SCHEMBL2746124

SCHEMBL2746124

C#Cc1ccccc1-c1cc(C(=O)O)ccc1C(=O)O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TTR P02766 2/20 0.47
PTPRC P08575 2/20 0.46
KDM4E B2RXH2 2/20 0.46
KMT2A Q03164 2/20 0.44
POLB P06746 1/20 0.44
SRD5A2 P31213 2/20 0.41
SRD5A1 P18405 1/20 0.41
CDC25A P30304 2/20 0.40
CDC25B P30305 2/20 0.40
HSD17B10 Q99714 1/20 0.40
PDK2 Q15119 1/20 0.39
CYP2C8 P10632 1/20 0.39
CYP2C9 P11712 1/20 0.39
PTPN1 P18031 1/20 0.38
ALDH1A1 P00352 3/20 0.38
HPGD P15428 2/20 0.38
CYP1A2 P05177 1/20 0.38
TSHR P16473 1/20 0.37
TDP1 Q9NUW8 2/20 0.37
MEN1 O00255 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5667928 0.93 KMO (0.47) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL5667272 0.82 NPC1 (0.46) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL5667422 0.82 TTR (0.45) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL10787725 0.81 TTR (0.58) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL5667651 0.79 TTR (0.46) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL29699465 0.79 KDM4E (0.55) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL29370227 0.79 KDM4E (0.55) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL7633476 0.79 KDM4E (0.55) TTRPTPRCKDM4EKMT2APOLB
SCHEMBL1713016 0.78 KDM4E (0.47) KDM4EPOLBSRD5A2CDC25ACDC25B
Naphthalene SCHEMBL28213981 0.78 KDM4E (0.49) TTRKDM4ECDC25ACDC25BHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
CN-101268119-B Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE CO 2011-08-17 CN disclosed
CN-101128514-B Benzoxazole resin precursor, polybenzoxazole resin, resin film and semiconductor device SUMITOMO BAKELITE CO 2011-05-25 CN disclosed
US-7608928-B2 Laminated body and semiconductor device JSR CORPORATION (JP) 2009-10-27 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
CN-101268119-A Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE CO (JP) 2008-09-17 CN disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
US-20080044664-A1 Laminated Body and Semiconductor Drive JSR CORPORATION (JP) 2008-02-21 US disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
CN-1231525-C Material for insulating film, varnish for insulating film, and semiconductor device using the same SUMITOMO BAKELITE CO (JP) 2005-12-14 CN disclosed
CN-1229422-C Heat-resistant resin precursor, heat-resistant resin, insulating film and semiconductr device SUMITOMO DAKELITE CO LTD (JP) 2005-11-30 CN disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
CN-1462289-A Heat-resistant resin precursor, heat-resistant resin, insulating film and semiconductr device SUMITOMO DAKELITE CO LTD (JP) 2003-12-17 CN disclosed
CN-1461323-A Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE CO (JP) 2003-12-10 CN disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed