SCHEMBL2746956

SCHEMBL2746956

O=C(O)C1C2CC3CC(C2)CC1(C12CC4CC(CC(C4)C1C(=O)O)C2)C3

nearest known ligand 0.38

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.38
CYP2C9 P11712 1/20 0.38
EPHX2 P34913 5/20 0.37
EPHX1 P07099 1/20 0.37
HSD11B1 P28845 1/20 0.35
FAAH O00519 1/20 0.35
P2RX7 Q99572 3/20 0.33
GAA P10253 1/20 0.33
GRM2 Q14416 1/20 0.33
GRM3 Q14832 1/20 0.33
HPGD P15428 1/20 0.33
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5357358 0.90 THRB (0.34) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL6742682 0.80 THRB (0.36) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL11342798 0.78 THRB (0.44) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL26217909 0.78 THRB (0.35) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL27817011 0.78 THRB (0.35) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL74823 0.78 THRB (0.35) THRBCYP2C9EPHX2EPHX1HSD11B1
Hydrochloric Acid SCHEMBL3683456 0.77 THRB (0.34) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL22261566 0.75 THRB (0.37) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL5802996 0.74 THRB (0.35) THRBCYP2C9EPHX2EPHX1HSD11B1
SCHEMBL5475255 0.74 HSD11B1 (0.44) EPHX2HSD11B1FAAHP2RX7HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed