SCHEMBL2746981

SCHEMBL2746981

O=C(OC#CC12CC3CC(CC(C3)C1)C2)c1ccccc1C(=O)OC#CC12CC3CC(CC(C3)C1)C2

nearest known ligand 0.42

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.42
ALDH1A1 P00352 3/20 0.41
MAPT P10636 1/20 0.41
HPGD P15428 1/20 0.41
TSHR P16473 1/20 0.41
ALOX12 P18054 1/20 0.41
HTT P42858 1/20 0.41
ATM Q13315 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
HSD17B10 Q99714 1/20 0.41
CNR2 P34972 5/20 0.40
FAAH O00519 3/20 0.40
P2RX7 Q99572 5/20 0.39
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
EPHX2 P34913 2/20 0.37
EPHX1 P07099 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.36
CNR1 P21554 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2746983 0.94 KDM4E (0.48) KDM4EALDH1A1MAPTHPGDTSHR
SCHEMBL8134445 0.73 CYP19A1 (0.46) KDM4EALDH1A1MAPTHPGDTSHR
SCHEMBL2710679 0.70 KDM4E (0.44) KDM4EALDH1A1MAPTHPGDTSHR
SCHEMBL5000604 0.70 P2RX7 (0.38) KDM4EALDH1A1MAPTHPGDTSHR
Hydrochloric Acid SCHEMBL5000607 0.69 KDM4E (0.43) KDM4EALDH1A1MAPTHPGDTSHR
SCHEMBL2708211 0.66 KDM4E (0.41) KDM4EALDH1A1MAPTHPGDTSHR
SCHEMBL28477742 0.66 KDM4E (0.43) KDM4EALDH1A1MAPTHPGDTSHR
SCHEMBL27255420 0.65 ALDH1A1 (0.50) KDM4EALDH1A1CNR2P2RX7MEN1
SCHEMBL2747858 0.65 APP (0.42) MAPTHTTFAAHP2RX7MEN1
SCHEMBL30443838 0.64 ALDH1A1 (0.49) KDM4EALDH1A1MAPTHPGDTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed