SCHEMBL2747573

SCHEMBL2747573

O=C(O)C#Cc1ccccc1C(F)(c1ccccc1C#CC(=O)O)C(F)(F)C(F)(F)F

nearest known ligand 0.39

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 2/20 0.39
PTGDR2 Q9Y5Y4 1/20 0.35
HSP90AA1 P07900 1/20 0.35
NTSR1 P30989 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.33
CES1 P23141 1/20 0.32
POLB P06746 1/20 0.31
LMNA P02545 1/20 0.30
GAA P10253 1/20 0.30
PDK1 Q15118 1/20 0.30
PDK2 Q15119 1/20 0.30
PDK3 Q15120 1/20 0.30
PDK4 Q16654 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3161990 0.83 FFAR1 (0.52) FFAR1PTGDR2HSP90AA1NTSR1POLB
SCHEMBL5025935 0.81 NPC1 (0.41) FFAR1PTGDR2SMN1; SMN2POLBLMNA
SCHEMBL30772315 0.74 HSP90AA1 (0.48) FFAR1HSP90AA1NTSR1SMN1; SMN2CES1
SCHEMBL2747178 0.72 FFAR1 (0.43) FFAR1PTGDR2SMN1; SMN2LMNA
SCHEMBL18104887 0.70 FFAR1 (0.50) FFAR1PTGDR2HSP90AA1NTSR1POLB
SCHEMBL1372606 0.70 ALDH1A1 (0.48) SMN1; SMN2POLBLMNAGAA
SCHEMBL30467436 0.70 PTGDR2 (0.43) FFAR1PTGDR2HSP90AA1NTSR1SMN1; SMN2
SCHEMBL6773718 0.70 PTGDR2 (0.43) FFAR1PTGDR2HSP90AA1NTSR1SMN1; SMN2
SCHEMBL4725495 0.69 FFAR1 (0.56) FFAR1PTGDR2HSP90AA1NTSR1GAA
SCHEMBL19303020 0.68 HSP90AA1 (0.35) FFAR1HSP90AA1NTSR1SMN1; SMN2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-7608928-B2 Laminated body and semiconductor device JSR CORPORATION (JP) 2009-10-27 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
US-20080044664-A1 Laminated Body and Semiconductor Drive JSR CORPORATION (JP) 2008-02-21 US disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed
EP-1760774-A1 LAMINATED BODY AND SEMICONDUCTOR DEVICE JSR Corporation (JP) 2007-03-07 EP disclosed