SCHEMBL2747592

SCHEMBL2747592

O=C(O)c1cccc(OC23CC4CC(C2)CC(Oc2cccc(C(=O)O)c2)(C4)C3)c1

nearest known ligand 0.47

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 1/20 0.47
EPHX2 P34913 3/20 0.46
KMT2A Q03164 3/20 0.44
FAAH O00519 2/20 0.44
CNR2 P34972 2/20 0.44
MEN1 O00255 1/20 0.44
ATM Q13315 1/20 0.43
NR4A2 P43354 3/20 0.42
HIF1A Q16665 1/20 0.41
EPAS1 Q99814 1/20 0.41
KMO O15229 1/20 0.41
MRGPRX4 Q96LA9 1/20 0.39
KDM4E B2RXH2 1/20 0.39
NPC1 O15118 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2726784 0.78 ALDH1A1 (0.44) EPHX2KMT2AHIF1AEPAS1KDM4E
SCHEMBL31544680 0.75 AKR1C3 (0.56) AKR1C3EPHX2HIF1AEPAS1KMO
SCHEMBL2747045 0.75 AKR1C3 (0.56) AKR1C3EPHX2HIF1AEPAS1KMO
SCHEMBL2747616 0.74 EPHX2 (0.44) AKR1C3EPHX2KMT2AFAAHCNR2
SCHEMBL2747044 0.73 AKR1C3 (0.50) AKR1C3EPHX2KMT2AFAAHCNR2
SCHEMBL11447452 0.72 SRD5A2 (0.50) EPHX2KMT2ACNR2MEN1KDM4E
SCHEMBL2747091 0.72 SERPINE1 (0.50) EPHX2KMT2AMEN1HIF1AEPAS1
SCHEMBL3323628 0.71 HIF1A (0.52) AKR1C3EPHX2KMT2AFAAHCNR2
SCHEMBL17344396 0.71 FAAH (0.45) EPHX2KMT2AFAAHKDM4E
SCHEMBL12093100 0.71 EPHX2 (0.57) AKR1C3EPHX2KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed