SCHEMBL275055

SCHEMBL275055

C=CCNC(=O)C(C)(CO)CO

nearest known ligand 0.42

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
MAPT P10636 1/20 0.42
KMT2A Q03164 1/20 0.39
FAAH O00519 1/20 0.39
ALDH1A1 P00352 4/20 0.35
PKM P14618 1/20 0.35
RAB9A P51151 1/20 0.34
HPGD P15428 3/20 0.33
GAA P10253 1/20 0.33
HTT P42858 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10818200 0.80 TSHR (0.46) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL26434018 0.80 TSHR (0.39) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL17801624 0.79 FAAH (0.40) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL1104182 0.75 RIPK1 (0.44) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL157278 0.75 SMN1; SMN2 (0.42) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL13544528 0.75 TSHR (0.42) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL17801557 0.75 TSHR (0.42) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL13544791 0.75 TSHR (0.42) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL157277 0.75 SMN1; SMN2 (0.42) TSHRSMN1; SMN2MAPTKMT2AFAAH
SCHEMBL5821712 0.73 SMN1; SMN2 (0.41) TSHRSMN1; SMN2MAPTKMT2AFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9465142-B2 Near-infrared absorptive composition, near-infrared cut filter using near-infrared absorptive composition, method for manufacturing near-infrared cut filter, and camera module and method for manufacturing camera module FUJIFILM CORPORATION (JP) 2016-10-11 US disclosed
US-9465142-B2 Near-infrared absorptive composition, near-infrared cut filter using near-infrared absorptive composition, method for manufacturing near-infrared cut filter, and camera module and method for manufacturing camera module FUJIFILM CORPORATION (JP) 2016-10-11 US disclosed
EP-1564591-B1 Polymerizable composition FUJIFILM CORP (JP) 2016-08-03 EP disclosed
EP-2131239-B1 Processing liquid for lithographic printing plate development and method of producing lithographic printing plates FUJIFILM CORP (JP) 2016-03-23 EP disclosed
US-9177921-B2 Manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2015-11-03 US disclosed
US-9177921-B2 Manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2015-11-03 US disclosed
US-20150130008-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-14 US disclosed
US-20150130008-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-14 US disclosed
US-20150124152-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-07 US disclosed
US-20150124152-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-07 US disclosed
US-20100055615-A1 METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-03-04 US disclosed
US-20100047537-A1 METHOD OF PRODUCING LITHOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-02-25 US disclosed
US-20090311494-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND PROCESS FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-12-17 US disclosed
US-20090246653-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-7531288-B2 Negative-working excellent in preservation stability and exhibits high sensitivity and good printing durability; hydrophilic support; and a photosensitive layer containing a polymerization initiator, a chain transfer agent, a compound having an ethylenically unsaturated double bond and a polymer binder FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20090087790-A1 METHOD OF PRODUCING A NEGATIVE PLANOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
US-7374863-B2 Polyurethane binder, photoinitiator, and acrylic acid; for use as image recording layer of negative lithographic printing plate precursor; drawing with laser light FUJIFILM CORPORATION (JP) 2008-05-20 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed