SCHEMBL275196

SCHEMBL275196

C=C(C)C(=O)OC(CCCC)C(O)CO

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.41
PTPN1 P18031 1/20 0.34
MAPT P10636 2/20 0.33
MAPK1 P28482 1/20 0.33
ALDH1A1 P00352 2/20 0.32
MEN1 O00255 2/20 0.32
KMT2A Q03164 2/20 0.32
CYP2D6 P10635 2/20 0.32
KDM4E B2RXH2 2/20 0.32
SPHK1 Q9NYA1 1/20 0.32
GMNN O75496 1/20 0.32
LMNA P02545 1/20 0.32
POLB P06746 1/20 0.32
THPO P40225 1/20 0.32
MTOR P42345 1/20 0.32
BLM P54132 1/20 0.32
TP53 P04637 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP3A4 P08684 1/20 0.32
CETP P11597 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6009554 0.90 ALDH1A1 (0.38) TSHRALDH1A1CYP2D6LMNATHRB
SCHEMBL13468872 0.89 TSHR (0.42) TSHRPTPN1MAPK1ALDH1A1CA1
SCHEMBL29754447 0.86 TSHR (0.33) TSHRALDH1A1
SCHEMBL4566106 0.84 TSHR (0.46) TSHRALDH1A1POLBHTTTHRB
SCHEMBL17358264 0.84 TSHR (0.49) TSHRPTPN1MAPTCYP2D6KDM4E
SCHEMBL5485747 0.83 TSHR (0.31) TSHR
SCHEMBL19898984 0.83 TSHR (0.39) TSHRALDH1A1THRB
SCHEMBL6669913 0.83 TSHR (0.40) TSHRMAPTMAPK1ALDH1A1LMNA
SCHEMBL6670156 0.83 TSHR (0.40) TSHRMAPTMAPK1ALDH1A1LMNA
SCHEMBL438474 0.81 TSHR (0.44) TSHRMAPK1ALDH1A1LMNACA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9465142-B2 Near-infrared absorptive composition, near-infrared cut filter using near-infrared absorptive composition, method for manufacturing near-infrared cut filter, and camera module and method for manufacturing camera module FUJIFILM CORPORATION (JP) 2016-10-11 US disclosed
US-9465142-B2 Near-infrared absorptive composition, near-infrared cut filter using near-infrared absorptive composition, method for manufacturing near-infrared cut filter, and camera module and method for manufacturing camera module FUJIFILM CORPORATION (JP) 2016-10-11 US disclosed
US-20150130008-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-14 US disclosed
US-20150130008-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-14 US disclosed
US-20150124152-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-07 US disclosed
US-20150124152-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-07 US disclosed
US-8735026-B2 Polymerizable composition, light-blocking color filter for solid-state imaging device, and solid-state imaging device FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
US-8735026-B2 Polymerizable composition, light-blocking color filter for solid-state imaging device, and solid-state imaging device FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
US-8557948-B2 Photosensitive composition, photosensitive film, photosensitive laminate, method of forming a permanent pattern, and printed board FUJIFILM CORPORATION (JP) 2013-10-15 US disclosed
US-8557948-B2 Photosensitive composition, photosensitive film, photosensitive laminate, method of forming a permanent pattern, and printed board FUJIFILM CORPORATION (JP) 2013-10-15 US disclosed
US-20090246653-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-20090246653-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-7374863-B2 Polyurethane binder, photoinitiator, and acrylic acid; for use as image recording layer of negative lithographic printing plate precursor; drawing with laser light FUJIFILM CORPORATION (JP) 2008-05-20 US disclosed
US-7374863-B2 Polyurethane binder, photoinitiator, and acrylic acid; for use as image recording layer of negative lithographic printing plate precursor; drawing with laser light FUJIFILM CORPORATION (JP) 2008-05-20 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed