SCHEMBL27526108

SCHEMBL27526108

COc1cc(Oc2ccccc2)cc(OC)c1P

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LTA4H P09960 3/20 0.54
▸ TSHR P16473 1/20 0.48
▸ ALDH1A1 P00352 3/20 0.47
▸ MAPK1 P28482 1/20 0.47
▸ HTT P42858 1/20 0.47
▸ L3MBTL1 Q9Y468 1/20 0.47
▸ TTR P02766 3/20 0.45
▸ CA4 P22748 2/20 0.44
▸ HTR6 P50406 1/20 0.43
▸ MEN1 O00255 3/20 0.42
▸ KMT2A Q03164 3/20 0.42
▸ KDM4E B2RXH2 1/20 0.42
▸ LMNA P02545 1/20 0.41
▸ ALOX12 P18054 1/20 0.41
▸ ERN1 O75460 1/20 0.41
▸ CA12 O43570 1/20 0.41
▸ CA1 P00915 1/20 0.41
▸ CA2 P00918 1/20 0.41
▸ CA7 P43166 1/20 0.41
▸ CA9 Q16790 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25189918 0.80 LTA4H (0.54) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL25181912 0.80 LTA4H (0.54) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL6882242 0.78 LTA4H (0.52) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL11646840 0.78 LTA4H (0.61) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL2094797 0.78 LTA4H (0.56) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL25186864 0.77 LTA4H (0.50) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL1026079 0.77 TUBB4A (0.49) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL18415521 0.76 LTA4H (0.73) LTA4HTSHRALDH1A1HTTCA4
SCHEMBL2099937 0.76 ALDH1A1 (0.63) LTA4HTSHRALDH1A1MAPK1HTT
SCHEMBL14588709 0.76 LTA4H (0.48) LTA4HTSHRALDH1A1MAPK1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100457823-C Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2009-02-04 — — CN disclosed
CN-1285636-C Process for producing oxyalkylene derivative MITSUI CHEMICALS INC (JP) 2006-11-22 — — CN disclosed
CN-1781985-A Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2006-06-07 — — CN disclosed
CN-1592764-A Method for producing organic compound, epoxy resin composition, cured product of the epoxy resin, and semiconductor device formed using the epoxy resin MITSUI CHEMICALS INC (JP) 2005-03-09 — — CN disclosed
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