O-Xylene

O-Xylene

SCHEMBL27533464

Cc1ccccc1C.OCCOCCO

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.50
ACHE P22303 1/20 0.50
MAPK1 P28482 1/20 0.50
MEN1 O00255 3/20 0.48
KMT2A Q03164 3/20 0.48
ALDH1A1 P00352 5/20 0.44
RECQL P46063 1/20 0.44
KCNH3 Q9ULD8 1/20 0.39
KDM4E B2RXH2 2/20 0.38
CYP1A2 P05177 1/20 0.38
THRB P10828 1/20 0.38
HTT P42858 1/20 0.38
MAPT P10636 1/20 0.38
HTR1A P08908 1/20 0.38
GAA P10253 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetraethylene Glycol SCHEMBL9860297 0.98 MEN1 (0.52) TSHRACHEMAPK1MEN1KMT2A
Triethylene Glycol SCHEMBL27450679 0.89 MEN1 (0.44) TSHRACHEMAPK1MEN1KMT2A
O-Xylene SCHEMBL10662343 0.89 ALDH1A1 (0.61) TSHRACHEMAPK1MEN1KMT2A
Butoxyethanol SCHEMBL6416346 0.88 TSHR (0.65) TSHRMAPK1MEN1KMT2AALDH1A1
Orthocresol SCHEMBL28023316 0.87 TSHR (0.42) TSHRACHEMAPK1MEN1KMT2A
Di(Hydroxyethyl)Ether SCHEMBL2470446 0.85 MEN1 (0.47) TSHRMAPK1MEN1KMT2AALDH1A1
O-Xylene SCHEMBL16163023 0.83 TSHR (0.48) TSHRACHEMEN1KMT2AALDH1A1
SCHEMBL2470447 0.82 ALDH1A1 (0.55) TSHRMEN1KMT2AALDH1A1KDM4E
SCHEMBL9310033 0.82 ALDH1A1 (0.55) TSHRMEN1KMT2AALDH1A1KDM4E
O-Xylene SCHEMBL80205 0.81 ACHE (0.67) TSHRACHEALDH1A1KDM4ECYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117157733-A Method for manufacturing semiconductor device and dicing die-bonding integrated film 株式会社力森诺科 2023-12-01 CN disclosed
CN-112266476-B TDI modified alkyd resin and high-transparency extinction material using same 广东美涂士建材股份有限公司 2023-03-31 CN disclosed
CN-114442447-A Toner and image forming apparatus 佳能株式会社 2022-05-06 CN disclosed
CN-112266476-A TDI modified alkyd resin and high-transparency extinction material using same 广东美涂士建材股份有限公司 2021-01-26 CN disclosed
CN-100411138-C Dicing/die boding sheet HITACHI CHEMICAL CO LTD (JP) 2008-08-13 CN disclosed
CN-1806326-A Dicing/die boding sheet HITACHI CHEMICAL CO LTD (JP) 2006-07-19 CN disclosed
CN-1255935-A Waterborne coating compsns. for metal containers WALSBAR CO LTD (US) 2000-06-07 CN disclosed