Quinoline

Quinoline

SCHEMBL27671669

CCCCCCCCCCCCc1ccc(-n2nc(C=Cc3ccccc3)cc2-c2ccccc2)cc1.c1ccc2ncccc2c1

nearest known ligand 0.45

Full drug profile on Sugi Atlas →

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ CNR1 P21554 1/20 0.45
▸ CNR2 P34972 1/20 0.45
▸ ALOX5 P09917 1/20 0.38
▸ TRPV1 Q8NER1 4/20 0.36
▸ TP53 P04637 1/20 0.36
▸ MAPT P10636 1/20 0.36
▸ SMN1; SMN2 Q16637 1/20 0.36
▸ TDP1 Q9NUW8 1/20 0.36
▸ HSD11B1 P28845 1/20 0.36
▸ PDPK1 O15530 2/20 0.35
▸ PDE10A Q9Y233 1/20 0.35
▸ PDGFRB P09619 1/20 0.34
▸ PDGFRA P16234 1/20 0.34
▸ PTPN1 P18031 1/20 0.34
▸ MET P08581 1/20 0.33
▸ MAPKAPK2 P49137 1/20 0.33
▸ EP300 Q09472 1/20 0.33
▸ KAT2A Q92830 1/20 0.33
▸ KAT2B Q92831 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Quinoline SCHEMBL28024422 0.96 CNR1 (0.42) CNR1CNR2ALOX5TRPV1HSD11B1
Quinoline SCHEMBL27651466 0.89 CNR1 (0.37) CNR1CNR2TP53MAPTSMN1; SMN2
Quinoline SCHEMBL28771536 0.84 RAB9A (0.43) CNR1CNR2MAPTPDE10APDGFRB
Quinoline SCHEMBL27722669 0.81 FABP3 (0.40) TRPV1MAPTPDPK1PDE10APDGFRB
Quinoline SCHEMBL27702294 0.81 FABP3 (0.40) ALOX5MAPTSMN1; SMN2PDE10APDGFRB
Quinoline SCHEMBL27722665 0.81 RPA1 (0.47) SMN1; SMN2TDP1PDE10A
Quinoline SCHEMBL28172017 0.81 CNR1 (0.46) CNR1CNR2ALOX5TRPV1SMN1; SMN2
Quinoline SCHEMBL28111528 0.79 RAB9A (0.35) ALOX5TRPV1MAPTPDE10APDGFRB
Quinoline SCHEMBL27671763 0.78 RAB9A (0.35) TRPV1MAPTPDE10APDGFRBPDGFRA
Quinoline SCHEMBL27651469 0.78 RAB9A (0.36) TRPV1MAPTPDE10APDGFRBPDGFRA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104111583-B Photosensitive polymer combination, photosensitive element, the forming method of photoresist figure and the manufacturing method of printed circuit board 日立化成株式会社 2019-01-01 — — CN disclosed
CN-104133343-B Photosensitive polymer combination, photosensitive element, the forming method of photoresist figure and the manufacture method of printed circuit board (PCB) 日立化成株式会社 2016-11-16 — — CN disclosed
CN-102375341-B The manufacture method of photosensitive polymer combination, element, resist figure and lead frame, printed-wiring board (PWB) and manufacture method thereof HITACHI CHEMICAL CO., LTD. (JP) 2016-04-06 — — CN disclosed
CN-105431778-A Photosensitive resin composition HITACHI CHEMICAL CO LTD 2016-03-23 — — CN disclosed
CN-102662306-B The manufacture method of photosensitive element, corrosion-resisting pattern formation method and printed circuit board (PCB) HITACHI CHEMICAL CO., LTD. (JP) 2015-11-25 — — CN disclosed
CN-104808444-A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same HITACHI CHEMICAL CO LTD 2015-07-29 — — CN disclosed
CN-104133343-A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2014-11-05 — — CN disclosed
CN-104133342-A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2014-11-05 — — CN disclosed
CN-104111583-A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2014-10-22 — — CN disclosed
CN-103543608-A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same HITACHI CHEMICAL CO LTD 2014-01-29 — — CN disclosed
CN-101421671-B Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board HITACHI CHEMICAL CO LTD 2012-05-30 — — CN disclosed
CN-102375341-A Manufacturing Method Of Photosensitive Resin Composite, Element And Slushing Compound Pattern, Manufacturing Method Of Lead Frame And Printed Circuit Board HITACHI CHEMICAL CO LTD 2012-03-14 — — CN disclosed
CN-102317864-A Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2012-01-11 — — CN disclosed
CN-102012634-A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2011-04-13 — — CN disclosed
CN-1945429-B Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K 2010-06-09 — — CN disclosed
CN-101421671-A Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2009-04-29 — — CN disclosed
CN-101228196-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2008-07-23 — — CN disclosed
CN-101180578-A Photosensitive resin composition, photosensitive element, method for forming photoresist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2008-05-14 — — CN disclosed
CN-1945429-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 — — CN disclosed
CN-1945428-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 — — CN disclosed
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