Quinoline

Quinoline

SCHEMBL27671763

CC(C)(C)c1ccc(-n2nc(C=Cc3ccccc3)cc2-c2ccccc2)cc1C(C)(C)C.c1ccc2ncccc2c1

nearest known ligand 0.35

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ RAB9A P51151 4/20 0.35
▸ NPC1 O15118 3/20 0.35
▸ KDM4E B2RXH2 2/20 0.35
▸ LMNA P02545 1/20 0.35
▸ PKM P14618 1/20 0.35
▸ MAPT P10636 2/20 0.35
▸ POLB P06746 1/20 0.35
▸ L3MBTL1 Q9Y468 1/20 0.35
▸ PDGFRB P09619 1/20 0.34
▸ PDGFRA P16234 1/20 0.34
▸ ABL1 P00519 3/20 0.33
▸ EPHB4 P54760 1/20 0.33
▸ AXL P30530 1/20 0.33
▸ PDE10A Q9Y233 1/20 0.33
▸ ALDH1A1 P00352 1/20 0.33
▸ MEN1 O00255 1/20 0.32
▸ CASP3 P42574 1/20 0.32
▸ KMT2A Q03164 1/20 0.32
▸ ATM Q13315 1/20 0.32
▸ SENP7 Q9BQF6 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Quinoline SCHEMBL27722669 0.88 FABP3 (0.40) RAB9ANPC1KDM4ELMNAPKM
Quinoline SCHEMBL27651469 0.86 RAB9A (0.36) RAB9ANPC1KDM4ELMNAPKM
Quinoline SCHEMBL28771536 0.86 RAB9A (0.43) RAB9ANPC1KDM4ELMNAPKM
Quinoline SCHEMBL27722665 0.82 RPA1 (0.47) RAB9ANPC1KDM4ELMNAPKM
Quinoline SCHEMBL27702294 0.82 FABP3 (0.40) RAB9ANPC1KDM4ELMNAPKM
Quinoline SCHEMBL28111528 0.82 RAB9A (0.35) RAB9ANPC1KDM4ELMNAPKM
Quinoline SCHEMBL28024422 0.79 CNR1 (0.42) RAB9ANPC1KDM4ELMNAPKM
Quinoline SCHEMBL27671669 0.78 CNR1 (0.45) MAPTPDGFRBPDGFRAPDE10AMET
Quinoline SCHEMBL28119447 0.74 MAPT (0.50) RAB9ANPC1KDM4EMAPTL3MBTL1
SCHEMBL3752745 0.72 NPC1 (0.54) RAB9ANPC1KDM4ELMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104111583-B Photosensitive polymer combination, photosensitive element, the forming method of photoresist figure and the manufacturing method of printed circuit board 日立化成株式会社 2019-01-01 — — CN disclosed
CN-104133343-B Photosensitive polymer combination, photosensitive element, the forming method of photoresist figure and the manufacture method of printed circuit board (PCB) 日立化成株式会社 2016-11-16 — — CN disclosed
CN-105431778-A Photosensitive resin composition HITACHI CHEMICAL CO LTD 2016-03-23 — — CN disclosed
CN-102662306-B The manufacture method of photosensitive element, corrosion-resisting pattern formation method and printed circuit board (PCB) HITACHI CHEMICAL CO., LTD. (JP) 2015-11-25 — — CN disclosed
CN-104808444-A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same HITACHI CHEMICAL CO LTD 2015-07-29 — — CN disclosed
CN-104133343-A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2014-11-05 — — CN disclosed
CN-104133342-A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2014-11-05 — — CN disclosed
CN-104111583-A Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2014-10-22 — — CN disclosed
CN-103543608-A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same HITACHI CHEMICAL CO LTD 2014-01-29 — — CN disclosed
CN-102317864-A Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2012-01-11 — — CN disclosed
CN-1945429-B Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K 2010-06-09 — — CN disclosed
CN-101421671-A Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2009-04-29 — — CN disclosed
CN-101228196-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2008-07-23 — — CN disclosed
CN-1945429-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 — — CN disclosed
CN-1945428-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 — — CN disclosed
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