Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | RECQL | P46063 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 2/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27720149 | 0.76 | TSHR (0.46) | — | |
| SCHEMBL2610011 | 0.73 | MMP1 (0.39) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL2044655 | 0.73 | MMP1 (0.39) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL13377782 | 0.73 | CYP2C19 (0.37) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL8830592 | 0.73 | MEN1 (0.37) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL823240 | 0.73 | MMP1 (0.39) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL27899749 | 0.71 | MMP1 (0.38) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL27621396 | 0.71 | MEN1 (0.36) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL27684184 | 0.71 | MEN1 (0.36) | MEN1CYP2C19RECQLKMT2ALMNA | |
| SCHEMBL27265848 | 0.71 | ALDH1A1 (0.39) | MEN1CYP2C19RECQLKMT2ALMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101300284-B | Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board | FUJI PHOTO FILM CO LTD | 2011-05-11 | — | — | CN | disclosed |
| CN-101300284-A | Epoxy resin composition, method for forming conductive film, method for forming conductive pattern and method for manufacturing multilayered wiring board | FUJI PHOTO FILM CO LTD (JP) | 2008-11-05 | — | — | CN | disclosed |