Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.62 |
| ▸ | TP53 | P04637 | 2/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.38 |
| ▸ | HIF1A | Q16665 | 4/20 | 0.38 |
| ▸ | ALOX15 | P16050 | 4/20 | 0.38 |
| ▸ | MAPT | P10636 | 3/20 | 0.38 |
| ▸ | LMNA | P02545 | 3/20 | 0.38 |
| ▸ | HPGD | P15428 | 3/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.38 |
| ▸ | HTT | P42858 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
| ▸ | HSPA5 | P11021 | 2/20 | 0.38 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.38 |
| ▸ | USP2 | O75604 | 1/20 | 0.38 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | HSPD1 | P10809 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8495178 | 1.00 | AMY1A (0.62) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL8588031 | 1.00 | AMY1A (0.62) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL8346927 | 1.00 | AMY1A (0.62) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL30002986 | 1.00 | AMY1A (0.62) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL1661235 | 0.95 | AMY1A (0.71) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL30374732 | 0.94 | AMY1A (0.59) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL278214 | 0.94 | AMY1A (0.59) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL8755476 | 0.91 | AMY1A (0.51) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL210491 | 0.91 | AMY1A (0.58) | AMY1ATP53TDP1TRPA1HIF1A | |
| SCHEMBL8347152 | 0.90 | AMY1A (0.50) | AMY1ATP53TDP1TRPA1HIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 143 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6312863-B1 | ALKALI-SOLUBLE RESIN; PHOTOSENSITIZER COMPRISING AN ESTER OF A 1,2-NAPHTHOQUINONEDIAZIDESULFONYL COMPOUND WITH A SUBSTITUTED M-BIS(HYDROXYBENZYL)PHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-06 | — | — | US | claimed |
| EP-0731074-B1 | Tetraphenol compounds, process for producing the same and their use as photosensitisers | SUMITOMO CHEMICAL CO (JP) | 1999-09-22 | — | — | EP | claimed |
| US-5726217-A | PHOTOSENSITIZERS FOR POSITIVE RESISTS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-03-10 | — | — | US | claimed |
| JP-9110755-A | — | — | None | — | — | JP | disclosed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-3896522-B1 | PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| US-20220411654-A1 | Radiation Curable Inkjet Ink for Manufacturing Printed Circuit Boards | AGFA-GEVAERT NV (BE) | 2022-12-29 | — | — | US | disclosed |
| US-11487200-B2 | Positive-type photosensitive resin composition and cured film prepared therefrom | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. | 2022-11-01 | — | — | US | disclosed |
| EP-3961676-A1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-02 | — | — | EP | disclosed |
| US-6106994-A | ESTERIFYING A POLYPHENOL COMPOUND AND NAPHTHOQUINONE-1,2-DIAZIDESULFONYL HALIDE IN THE PRESENCE OF FOR EXAMPLE MONOMETHYLDICYCLOHEXYLAMINE, AND POSITIVE PHOTOSENSITIVE COMPOSITION CONTAINS RESULTANT ESTER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-08-22 | — | — | US | disclosed |
| EP-0731074-B1 | Tetraphenol compounds, process for producing the same and their use as photosensitisers | SUMITOMO CHEMICAL CO (JP) | 1999-09-22 | — | — | EP | disclosed |
| EP-0902326-A2 | Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-03-17 | — | — | EP | disclosed |
| US-5866724-A | Positive resist composition and photosensitizers | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1999-02-02 | — | — | US | disclosed |
| US-5853948-A | Positive photoresist compositions and multilayer resist materials using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-12-29 | — | — | US | disclosed |
| US-5726217-A | PHOTOSENSITIZERS FOR POSITIVE RESISTS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1998-03-10 | — | — | US | disclosed |
| JP-H09110755-A | DIMETHYLOLATED TETRAPHENOL COMPOUND AND ITS PRODUCTION | SUMITOMO CHEM CO LTD | 1997-04-28 | — | — | JP | disclosed |
| EP-0769485-A1 | Positive resist composition and photosensitizers | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1997-04-23 | — | — | EP | disclosed |
| EP-0731074-A2 | Tetraphenol compounds, process for producing the same and their use as photosensitisers | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1996-09-11 | — | — | EP | disclosed |