SCHEMBL27902844

SCHEMBL27902844

CCCCC(CC)COCC(O)COc1cccc2cc3ccccc3cc12

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NR2E1 Q9Y466 5/20 0.44
CYP1A2 P05177 4/20 0.42
KDM4E B2RXH2 1/20 0.42
MEN1 O00255 1/20 0.42
CYP2C19 P33261 1/20 0.42
KMT2A Q03164 1/20 0.42
CYP2D6 P10635 4/20 0.40
ADRB2 P07550 4/20 0.40
ADRB1 P08588 4/20 0.40
SIGMAR1 Q99720 4/20 0.40
ALDH1A1 P00352 4/20 0.40
SLC6A4 P31645 3/20 0.40
HTR2B P41595 3/20 0.40
ADRB3 P13945 3/20 0.40
HTR2A P28223 3/20 0.40
HTR2C P28335 3/20 0.40
HTR6 P50406 3/20 0.40
LMNA P02545 3/20 0.40
SCN1A P35498 2/20 0.40
SLC10A1 Q14973 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Anthracene SCHEMBL28584681 0.88 CA2 (0.44) NR2E1CYP1A2KDM4EMEN1CYP2C19
SCHEMBL3414896 0.88 CA2 (0.44) NR2E1CYP1A2KDM4EMEN1CYP2C19
SCHEMBL13328779 0.82 KDM4E (0.55) CYP1A2KDM4EMEN1CYP2C19KMT2A
SCHEMBL27902832 0.80 CYP1A2 (0.55) NR2E1CYP1A2KDM4EMEN1CYP2C19
SCHEMBL21989183 0.80 ALDH1A1 (0.48) KDM4EMEN1KMT2ACYP2D6ADRB2
SCHEMBL28827376 0.78 HTR1B (0.43) NR2E1CYP1A2KDM4EMEN1CYP2C19
Anthracene SCHEMBL28827369 0.78 HTR1B (0.43) NR2E1CYP1A2KDM4EMEN1CYP2C19
SCHEMBL14655726 0.78 ALDH1A1 (0.47) KDM4EMEN1KMT2AALDH1A1LMNA
SCHEMBL15677174 0.78 LMNA (0.45) CYP1A2KDM4EMEN1KMT2AALDH1A1
SCHEMBL17912824 0.78 HTR1B (0.54) NR2E1CYP1A2KDM4EMEN1CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102822306-A Adhesive composition, adhesive tape, method for processing semiconductor wafer, and method for manufacturing TSV wafer SEKISUI CHEMICAL CO LTD 2012-12-12 CN disclosed