SCHEMBL28065732

SCHEMBL28065732

CCCCCCCC(CCCC)C(CCCC)(CCCC)C(=O)OCCCC

nearest known ligand 0.42

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
FDPS P14324 1/20 0.42
NAAA Q02083 1/20 0.40
ZDHHC7 Q9NXF8 1/20 0.39
ALDH1A1 P00352 1/20 0.39
EPHX1 P07099 1/20 0.38
CA2 P00918 1/20 0.38
ATM Q13315 1/20 0.37
USP2 O75604 1/20 0.37
LMNA P02545 1/20 0.37
TSHR P16473 3/20 0.37
GPR84 Q9NQS5 3/20 0.36
DGKA P23743 1/20 0.36
FFAR1 O14842 1/20 0.36
MAPT P10636 1/20 0.35
HPGD P15428 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28110101 1.00 FDPS (0.42) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL28117806 1.00 FDPS (0.42) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL2117715 0.92 NAAA (0.44) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL5665395 0.92 NAAA (0.44) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL2119181 0.92 NAAA (0.44) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL3190353 0.92 NAAA (0.44) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL20531189 0.92 NAAA (0.44) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL19664738 0.92 NAAA (0.44) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL27875046 0.87 ALDH1A1 (0.41) FDPSNAAAZDHHC7ALDH1A1EPHX1
SCHEMBL7868971 0.81 NAAA (0.43) FDPSNAAAZDHHC7ALDH1A1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114846631-A Light emitting device package and method of manufacturing the same 味之素株式会社 2022-08-02 CN disclosed
CN-106967208-B Coated particles 味之素株式会社 2021-09-10 CN disclosed
CN-107406607-B Two-component epoxy resin composition for fiber-reinforced composite material, and fiber-reinforced composite material 东丽株式会社 2020-07-10 CN disclosed
CN-106967208-A Coated particle 味之素株式会社 2017-07-21 CN disclosed
CN-106470524-A RESIN SHEET WITH SUPPORT 味之素株式会社 2017-03-01 CN disclosed
CN-106465505-A Manufacturing method for sealed body 味之素株式会社 2017-02-22 CN disclosed
CN-102985460-B Curing agent composition for epoxy resin, curable resin composition, and cured product thereof 株式会社大赛璐 2017-02-22 CN disclosed
CN-106433025-A Resin composition 味之素株式会社 2017-02-22 CN disclosed
CN-106433407-A Resin composition 味之素株式会社 2017-02-22 CN disclosed
CN-106317777-A Resin composition 味之素株式会社 2017-01-11 CN disclosed
CN-106256862-A Resin composition 味之素株式会社 2016-12-28 CN disclosed
CN-106256853-A Molded underfill resin combination 味之素株式会社 2016-12-28 CN disclosed
CN-104053721-B Resin composition 味之素株式会社 2016-12-21 CN disclosed
CN-103739827-B Resin combination 味之素株式会社 2016-11-23 CN disclosed
CN-106085100-A Resin combination 味之素株式会社 2016-11-09 CN disclosed
CN-106085169-A Solidification compound 味之素株式会社 2016-11-09 CN disclosed
CN-102455597-B X-ray sensitive resin composition, cured film and forming method thereof, liquid crystal display cells array base palte and forming method thereof JSR株式会社 2016-06-29 CN disclosed
CN-105683284-A Sealing resin composition and sealing sheet 味之素株式会社 2016-06-15 CN disclosed
CN-105683283-A Hydrotalcite-containing sealing resin composition and sealing sheet 味之素株式会社 2016-06-15 CN disclosed