SCHEMBL28085108

SCHEMBL28085108

C=CCc1ncc[nH]1.O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.40
ALDH1A1 P00352 2/20 0.40
POLB P06746 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
TLK2 Q86UE8 1/20 0.38
HCAR3 P49019 2/20 0.37
CDC25A P30304 1/20 0.37
CDC25B P30305 1/20 0.37
HSD17B10 Q99714 1/20 0.37
TBXAS1 P24557 2/20 0.36
GAA P10253 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
KDM4C Q9H3R0 2/20 0.36
MAPT P10636 2/20 0.36
KDM6B O15054 1/20 0.36
TET3 O43151 1/20 0.36
KDM4A O75164 1/20 0.36
BBOX1 O75936 1/20 0.36
KDM5A P29375 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bicarbonate SCHEMBL28219611 0.80 TBXAS1 (0.47) KDM4EALDH1A1TBXAS1GAASMN1; SMN2
SCHEMBL28585559 0.80 TAAR1 (0.61) KDM4EALDH1A1TDP1CDC25ACDC25B
Gallic Acid SCHEMBL28294555 0.79 KDM4E (0.46) KDM4EALDH1A1POLBTDP1L3MBTL1
SCHEMBL27872180 0.78 TAAR1 (0.41) KDM4EALDH1A1TBXAS1GAASMN1; SMN2
Acetic Acid SCHEMBL27701881 0.77 TBXAS1 (0.45) KDM4EALDH1A1TBXAS1GAASMN1; SMN2
Acrylic Acid SCHEMBL28317803 0.77 TBXAS1 (0.45) KDM4EALDH1A1TBXAS1GAASMN1; SMN2
Formic Acid SCHEMBL4203275 0.77 ALDH1A1 (0.38) KDM4EALDH1A1POLBTDP1L3MBTL1
SCHEMBL11648276 0.77 TBXAS1 (0.51) ALDH1A1TBXAS1MAPT
Urea SCHEMBL28287104 0.76 TBXAS1 (0.42) KDM4ETBXAS1GAASMN1; SMN2KLK1
SCHEMBL28703592 0.75 ALDH1A1 (0.48) KDM4EALDH1A1POLBTDP1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104194271-B Dielectric composite material for fingerprint sensor induction layer and preparation method thereof 天津德高化成新材料股份有限公司 2016-08-17 CN claimed
CN-109843965-A Composition epoxy resin is used in printing distributing board formation 日产化学株式会社 2019-06-04 CN disclosed
CN-109280523-A Epoxy sealing glue 东莞市沅邦电子材料有限公司 2019-01-29 CN disclosed
CN-104448700-B Resin combination 味之素株式会社 2019-01-22 CN disclosed
CN-108349919-A Multi-functional epoxy compound and curable adhensive compositions containing it 日产化学工业株式会社 2018-07-31 CN disclosed
CN-108350252-A Epoxy reactive diluent and composition epoxy resin containing it 日产化学工业株式会社 2018-07-31 CN disclosed
CN-108350146-A The composition epoxy resin of alkyl is stretched containing long-chain 日产化学工业株式会社 2018-07-31 CN disclosed
CN-105792947-B Method of forming layered coating film 关西涂料株式会社 2018-05-29 CN disclosed
CN-103975003-B Carbon fiber forming blank, moulding material and carbon fibre reinforced composite 东丽株式会社 2017-07-28 CN disclosed