Benzil

Benzil

SCHEMBL28112962

CCc1ccc2sc3ccccc3c(=O)c2c1CC.O=C(C(=O)c1ccccc1)c1ccccc1

nearest known ligand 0.44

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.43
RAB9A P51151 4/20 0.43
CYP1A2 P05177 3/20 0.43
NPC1 O15118 3/20 0.43
CYP3A4 P08684 2/20 0.43
HPGD P15428 2/20 0.43
CYP2C9 P11712 1/20 0.43
CYP2C19 P33261 1/20 0.43
MAOA P21397 3/20 0.43
MAOB P27338 3/20 0.43
ALDH1A1 P00352 4/20 0.40
KMT2A Q03164 3/20 0.40
POLB P06746 2/20 0.40
MEN1 O00255 1/20 0.40
GAA P10253 1/20 0.40
LMNA P02545 3/20 0.39
ABCB11 O95342 1/20 0.39
TP53 P04637 1/20 0.39
CHRM2 P08172 1/20 0.39
HTR1A P08908 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL56031 0.89 MAPT (0.51) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL29411158 0.89 MAPT (0.51) MAPTRAB9ACYP1A2NPC1CYP3A4
(Z)-1,2-Diphenylethene SCHEMBL28216307 0.84 MAPT (0.44) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL18535740 0.80 MAPT (0.48) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL27842559 0.80 MAPT (0.48) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL29052881 0.80 CNR2 (0.47) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL232235 0.79 GPR3 (0.43) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL28259024 0.79 MAPT (0.42) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL29269233 0.79 MAOA (0.56) MAPTRAB9ACYP1A2NPC1CYP3A4
SCHEMBL28595024 0.77 MAPT (0.50) MAPTRAB9ACYP1A2NPC1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106104381-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2016-11-09 CN disclosed