Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 8/20 | 0.51 |
| ▸ | RAB9A | P51151 | 4/20 | 0.51 |
| ▸ | NPC1 | O15118 | 3/20 | 0.51 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.51 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.51 |
| ▸ | HPGD | P15428 | 2/20 | 0.51 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.51 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.51 |
| ▸ | MAOA | P21397 | 2/20 | 0.48 |
| ▸ | MAOB | P27338 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.44 |
| ▸ | POLB | P06746 | 4/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.44 |
| ▸ | MEN1 | O00255 | 2/20 | 0.44 |
| ▸ | GAA | P10253 | 1/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.44 |
| ▸ | CHRM2 | P08172 | 2/20 | 0.42 |
| ▸ | HTR1A | P08908 | 2/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29411158 | 1.00 | MAPT (0.51) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| (Z)-1,2-Diphenylethene SCHEMBL28216307 | 0.91 | MAPT (0.44) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| SCHEMBL18535740 | 0.90 | MAPT (0.48) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| SCHEMBL27842559 | 0.90 | MAPT (0.48) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| Benzil SCHEMBL28112962 | 0.89 | MAPT (0.43) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| SCHEMBL232235 | 0.89 | GPR3 (0.43) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| SCHEMBL28259024 | 0.88 | MAPT (0.42) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| SCHEMBL28595024 | 0.86 | MAPT (0.50) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| SCHEMBL20659803 | 0.85 | MAPT (0.41) | MAPTRAB9ANPC1CYP1A2CYP3A4 | |
| SCHEMBL29269233 | 0.85 | MAOA (0.56) | MAPTRAB9ANPC1CYP1A2CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 10363 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122080620-A | Low-shrinkage photo-curing elastic resin composition based on synergistic compensation and application thereof | — | 2026-05-26 | — | — | CN | claimed |
| US-20250244664-A1 | PHOTORESIST COMPOSITIONS AND PATTERNING METHODS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2025-07-31 | — | — | US | claimed |
| EP-4004131-B2 | UV INKJET COMPOSITIONS | SUN CHEMICAL BV (NL) | 2025-07-23 | — | — | EP | claimed |
| US-12351721-B2 | Ink jet recording method | SEIKO EPSON CORPORATION (JP) | 2025-07-08 | — | — | US | claimed |
| US-12232338-B2 | Low-voltage operation dual-gate organic thin-film transistors and methods of manufacturing thereof | CORNING INCORPORATED (US) | 2025-02-18 | — | — | US | claimed |
| CN-119264336-A | Polybutadiene acrylate photosensitive resin composition with self-healing property and application thereof in 405nm photocuring 3D printing | 福建农林大学 | 2025-01-07 | — | — | CN | claimed |
| CN-111045296-B | UV patternable polymer blend for organic thin film transistor | 康宁股份有限公司 | 2024-12-27 | — | — | CN | claimed |
| CN-118931467-A | High-adhesive-strength and high-water-resistance UV (ultraviolet) glue and preparation method thereof | 河源然生新材料有限公司 | 2024-11-12 | — | — | CN | claimed |
| EP-2445722-B2 | PRINTING METHOD | SERICOL LTD (GB) | 2024-09-04 | — | — | EP | claimed |
| US-12071551-B2 | UV-curable ink composition and a UV-cured printing process | SUN CHEMICAL B.V. (NL) | 2024-08-27 | — | — | US | claimed |
| US-5637395-A | PHOTOCURABLE RUBBER OR ACRYL-BASED PRESSURE SENSITIVE ADHESIVE; THREE DIMENSIONAL NETWORK | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1997-06-10 | — | — | US | claimed |
| US-5532286-A | BONDING STRENGTH | EASTMAN KODAK COMPANY (US) | 1996-07-02 | — | — | US | claimed |
| EP-0683174-A2 | Thioether containing photopolymerizable compositions | EASTMAN KODAK COMPANY (US) | 1995-11-22 | — | — | EP | claimed |
| EP-0283990-B1 | A heat-resistant photosensitive resin composition | TOKYO OHKA KOGYO CO LTD (JP) | 1994-01-26 | — | — | EP | claimed |
| EP-0157508-B1 | THIN ADHESIVE SHEET FOR USE IN WORKING SEMICONDUCTOR WAFERS | NITTO DENKO CORPORATION (JP) | 1992-07-15 | — | — | EP | claimed |
| US-4996132-A | Heat-resistant photosensitive resin composition | TOYKO OHKA KOGYO CO. LTD. (JP) | 1991-02-26 | — | — | US | claimed |
| EP-0306273-A2 | Alkaline developable liquid photoimageable solder resist ink composition | ARAKAWA CHEMICAL INDUSTRIES, LIMITED (JP) | 1989-03-08 | — | — | EP | claimed |
| EP-0283990-A2 | A heat-resistant photosensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1988-09-28 | — | — | EP | claimed |
| EP-0280295-A2 | A heat-resistant photosensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1988-08-31 | — | — | EP | claimed |
| EP-0157508-A2 | Thin adhesive sheet for use in working semiconductor wafers | NITTO DENKO CORPORATION (JP) | 1985-10-09 | — | — | EP | claimed |