SCHEMBL28124390

SCHEMBL28124390

C=C(C(N)=O)C(C)(C)CO

nearest known ligand 0.39

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1135166 0.80 TDP1 (0.39) TDP1
SCHEMBL3229799 0.80 TDP1 (0.39) TDP1
Ammonia Solution, Strong SCHEMBL3915936 0.78 TDP1 (0.38) TDP1
SCHEMBL10701254 0.78 LMNA (0.42) TDP1
SCHEMBL159079 0.78 TDP1 (0.38) TDP1
SCHEMBL3432786 0.76 TDP1 (0.42) TDP1
SCHEMBL9126102 0.76 KDM4E (0.46) TDP1
SCHEMBL17672216 0.75 TDP1 (0.35) TDP1
SCHEMBL9473080 0.74 TDP1 (0.31) TDP1
SCHEMBL528103 0.74 TDP1 (0.36) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104995277-B Composition for polishing, composition for polishing manufacture method and abrasive material manufacture method 福吉米株式会社 2018-05-08 CN disclosed
CN-105073941-B Composition for polishing and abrasive material manufacture method 福吉米株式会社 2018-01-30 CN disclosed
CN-106463386-A Method for polishing silicon wafer, polishing composition, and polishing composition set 福吉米株式会社 2017-02-22 CN disclosed