SCHEMBL28247753

SCHEMBL28247753

CCCCCCCCCCCCCCCCCCC(N)C(N)(CCCCC)CCCCCCCCCCCCCCCCCC

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.44
SPHK1 Q9NYA1 2/20 0.42
SMPD1 P17405 3/20 0.39
CYP2D6 P10635 2/20 0.39
LMNA P02545 2/20 0.39
FDPS P14324 2/20 0.39
TP53 P04637 2/20 0.39
LAP3 P28838 2/20 0.39
PLA2G1B P04054 1/20 0.39
PLA2G2A P14555 1/20 0.39
GMNN O75496 1/20 0.39
POLB P06746 1/20 0.39
THPO P40225 1/20 0.39
MTOR P42345 1/20 0.39
BLM P54132 1/20 0.39
KDM4E B2RXH2 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
MAPT P10636 1/20 0.39
CETP P11597 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23407456 1.00 OPRM1 (0.44) OPRM1SPHK1SMPD1CYP2D6LMNA
SCHEMBL19032634 1.00 OPRM1 (0.44) OPRM1SPHK1SMPD1CYP2D6LMNA
SCHEMBL15234071 1.00 OPRM1 (0.44) OPRM1SPHK1SMPD1CYP2D6LMNA
SCHEMBL19032541 1.00 OPRM1 (0.44) OPRM1SPHK1SMPD1CYP2D6LMNA
SCHEMBL7611818 0.92 DNM1 (0.48) OPRM1SPHK1SMPD1FDPS
SCHEMBL6139849 0.92 OPRM1 (0.41) OPRM1SPHK1SMPD1CYP2D6LMNA
SCHEMBL10487492 0.89 FAAH (0.41) SPHK1CYP2D6LMNATP53GMNN
SCHEMBL23407470 0.89 FAAH (0.41) SPHK1CYP2D6LMNATP53GMNN
SCHEMBL11444878 0.86 OPRM1 (0.37) OPRM1SPHK1FDPSTP53LAP3
SCHEMBL11051697 0.85 SPHK1 (0.43) OPRM1SPHK1SMPD1CYP2D6LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108695400-A A kind of laminar structure of stacked wafer moudle and preparation method thereof, stacked wafer moudle 上迈(上海)新能源科技有限公司 2018-10-23 CN claimed
CN-108695401-A A kind of laminar structure of double-side assembly and preparation method thereof, double-side assembly 上迈(上海)新能源科技有限公司 2018-10-23 CN claimed