SCHEMBL28279264

SCHEMBL28279264

CC(Cc1ccccc1)c1cccc(N2C(=O)C=CC2=O)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 11/20 0.55
FAAH O00519 4/20 0.50
HSP90AA1 P07900 3/20 0.50
ALDH1A1 P00352 2/20 0.50
PKM P14618 2/20 0.50
HTT P42858 2/20 0.50
ATM Q13315 1/20 0.50
MAPT P10636 1/20 0.47
HPGD P15428 1/20 0.47
XBP1 P17861 1/20 0.47
MAPK1 P28482 1/20 0.47
CCR6 P51684 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47
PARP1 P09874 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
HPN P05981 1/20 0.40
MEN1 O00255 1/20 0.40
KMT2A Q03164 1/20 0.40
TAAR1 Q96RJ0 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29353761 0.93 MGLL (0.56) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL331574 0.93 MGLL (0.56) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL7548197 0.80 MGLL (0.55) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL3182074 0.79 MGLL (0.56) MGLLFAAHHSP90AA1PKMMAPK1
SCHEMBL9490679 0.78 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL18814236 0.77 MGLL (0.68) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL11723892 0.75 MGLL (0.60) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL27751309 0.75 MGLL (0.60) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL25381540 0.74 TAAR1 (0.52) TAAR1
SCHEMBL8983689 0.72 TAAR1 (0.56) TAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113717526-B Resin composition, support with resin layer, prepreg, and laminate 株式会社力森诺科 2024-06-11 CN disclosed
CN-113337117-B Resin composition, support, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar 株式会社力森诺科 2023-07-14 CN disclosed
CN-114479459-A Resin composition, laminate, and multilayer printed wiring board 昭和电工材料株式会社 2022-05-13 CN disclosed
CN-109476923-B Resin composition, laminate, and multilayer printed wiring board 昭和电工材料株式会社 2022-04-05 CN disclosed
CN-113717526-A Resin composition, support with resin layer, prepreg, and laminate 昭和电工材料株式会社 2021-11-30 CN disclosed
CN-107207724-B Resin composition, support with resin layer, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar 昭和电工材料株式会社 2021-09-21 CN disclosed
CN-113337117-A Resin composition, support, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar 昭和电工材料株式会社 2021-09-03 CN disclosed
CN-113321888-A Resin composition, resin film, prepreg, laminate, multilayer printed wiring board, and method for producing multilayer printed wiring board 昭和电工材料株式会社 2021-08-31 CN disclosed
CN-109415551-B Resin composition, resin film, laminate, multilayer printed wiring board, and method for producing multilayer printed wiring board 昭和电工材料株式会社 2021-07-27 CN disclosed
CN-109476901-B Resin composition, support with resin layer, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar 昭和电工材料株式会社 2021-07-09 CN disclosed
CN-112745779-A Fluororesin substrate laminate 昭和电工材料株式会社 2021-05-04 CN disclosed
CN-109476901-A Resin composition, support with resin layer, prepreg, laminate, multilayer printed wiring board, and printed wiring board for millimeter wave radar 日立化成株式会社 2019-03-15 CN disclosed
CN-109415551-A Resin composition, resin film, laminate, multilayer printed wiring board, and method for producing multilayer printed wiring board 日立化成株式会社 2019-03-01 CN disclosed