Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 15/20 | 0.56 |
| ▸ | FAAH | O00519 | 6/20 | 0.51 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.44 |
| ▸ | PKM | P14618 | 2/20 | 0.44 |
| ▸ | HTT | P42858 | 2/20 | 0.44 |
| ▸ | ATM | Q13315 | 1/20 | 0.44 |
| ▸ | MAPT | P10636 | 1/20 | 0.42 |
| ▸ | HPGD | P15428 | 1/20 | 0.42 |
| ▸ | XBP1 | P17861 | 1/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.42 |
| ▸ | CCR6 | P51684 | 1/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.42 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.42 |
| ▸ | HPN | P05981 | 1/20 | 0.41 |
| ▸ | PARP1 | P09874 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29353761 | 1.00 | MGLL (0.56) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL28279264 | 0.93 | MGLL (0.55) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL3182074 | 0.87 | MGLL (0.56) | MGLLFAAHHSP90AA1PKMMAPK1 | |
| SCHEMBL7548197 | 0.83 | MGLL (0.55) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL18814236 | 0.81 | MGLL (0.68) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL9490679 | 0.79 | MGLL (0.64) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL11723892 | 0.76 | MGLL (0.60) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL27751309 | 0.76 | MGLL (0.60) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL8412010 | 0.73 | MGLL (0.65) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL3482931 | 0.73 | MGLL (1.00) | MGLLFAAHHSP90AA1ALDH1A1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024185371-A1 | RESIN COMPOSITION, AND INTER-LAYER INSULATING ADHESIVE FILM, LAMINATED CIRCUIT BOARD, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE USING SAME | ナミックス株式会社 | 2024-09-12 | — | — | WO | disclosed |
| EP-3405010-B1 | MULTILAYER TRANSMISSION LINE PLATE | RESONAC CORP (JP) | 2024-06-26 | — | — | EP | disclosed |
| EP-3246352-B1 | RESIN COMPOSITION, SUPPORT WITH RESIN LAYER, PREPREG, LAMINATE, MULTILAYERED PRINTED WIRING BOARD, AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR | RESONAC CORP (JP) | 2024-04-10 | — | — | EP | disclosed |
| US-11745482-B2 | Fluororesin substrate laminate | RESONAC CORPORATION (JP) | 2023-09-05 | — | — | US | disclosed |
| EP-3483214-B1 | RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD | RESONAC CORP (JP) | 2023-08-30 | — | — | EP | disclosed |
| US-11377546-B2 | Resin composition, laminate sheet, and multilayer printed wiring board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| US-11339251-B2 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-24 | — | — | US | disclosed |
| US-11286346-B2 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-03-29 | — | — | US | disclosed |
| EP-3489300-B1 | RESIN COMPOSITION, RESIN LAYER-PROVIDED SUPPORT, PREPREG, LAMINATE SHEET, MULTILAYER PRINTED WIRING BOARD, AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR | SHOWA DENKO MATERIALS CO LTD (JP) | 2022-03-09 | — | — | EP | disclosed |
| CN-108464060-B | Multilayer transmission circuit board | 昭和电工材料株式会社 | 2022-01-25 | — | — | CN | disclosed |
| US-20130040153-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE, THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | FUJIMOTO DAISUKE (JP) | 2013-02-14 | — | — | US | disclosed |
| EP-2546287-A1 | Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-20130000843-A1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | RESONAC CORPORATION (JP) | 2013-01-03 | — | — | US | disclosed |
| US-8277948-B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2012-10-02 | — | — | US | disclosed |
| US-20120214009-A1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | RESONAC CORPORATION (JP) | 2012-08-23 | — | — | US | disclosed |
| EP-2407503-A1 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2012-01-18 | — | — | EP | disclosed |
| US-20100233495-A1 | Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same | RESONAC CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| US-20100129676-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | RESONAC CORPORATION (JP) | 2010-05-27 | — | — | US | disclosed |
| EP-2141198-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| EP-1985654-A1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2008-10-29 | — | — | EP | disclosed |