Xylose

Xylose

SCHEMBL28295161

O=CC(O)C(O)C(O)CO.Oc1ccccc1

nearest known ligand 0.39

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.39
CA12 O43570 1/20 0.39
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
GLA P06280 1/20 0.39
CA3 P07451 1/20 0.39
CA4 P22748 1/20 0.39
CA9 Q16790 1/20 0.39
CA14 Q9ULX7 1/20 0.39
LMNA P02545 3/20 0.34
L3MBTL1 Q9Y468 2/20 0.34
PDE4A P27815 1/20 0.34
USP2 O75604 1/20 0.32
SLCO1B1 Q9Y6L6 1/20 0.32
MAPT P10636 3/20 0.32
KDM4E B2RXH2 1/20 0.32
FNTA P49354 1/20 0.32
FNTB P49356 1/20 0.32
AKR1B1 P15121 1/20 0.31
CES2 O00748 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Demannose SCHEMBL27735211 0.95 TDP1 (0.38) TDP1CA12CA1CA2GLA
Demannose SCHEMBL3515070 0.95 TDP1 (0.38) TDP1CA12CA1CA2GLA
Demannose SCHEMBL10808821 0.92 TDP1 (0.35) TDP1CA12CA1CA2GLA
Demannose SCHEMBL28270412 0.89 TDP1 (0.33) TDP1CA12CA1CA2GLA
Demannose SCHEMBL11581936 0.89 USP2 (0.39) TDP1CA12CA1CA2GLA
Demannose SCHEMBL28138394 0.85 LMNA (0.42) TDP1LMNAL3MBTL1PDE4AUSP2
Galactose SCHEMBL16210938 0.85 LMNA (0.42) TDP1LMNAL3MBTL1PDE4AUSP2
Demannose SCHEMBL1996276 0.85 LMNA (0.42) TDP1LMNAL3MBTL1PDE4AUSP2
Xylose SCHEMBL12491343 0.83 LMNA (0.39) TDP1LMNAL3MBTL1PDE4AUSP2
Xylose SCHEMBL16755646 0.83 LMNA (0.39) TDP1LMNAL3MBTL1PDE4AUSP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109643693-A Membrane type enveloping semiconductor component, its semiconductor packages obtained and preparation method 三星SDI株式会社 2019-04-16 CN disclosed