SCHEMBL28300488

SCHEMBL28300488

O=CNC(NC=O)C(O)CO

nearest known ligand 0.40

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
AKR1B1 P15121 1/20 0.38
LMNA P02545 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
TDP1 Q9NUW8 1/20 0.35
ADH1B P00325 1/20 0.33
ADH1C P00326 1/20 0.33
ADH1A P07327 1/20 0.33
KDM4E B2RXH2 2/20 0.31
PDE4A P27815 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9760970 0.77 AKR1B1 (0.36) AKR1B1LMNAL3MBTL1TDP1ADH1B
SCHEMBL1813293 0.72
SCHEMBL2292654 0.70 LMNA (0.46) AKR1B1LMNAL3MBTL1TDP1KDM4E
SCHEMBL1535250 0.70 LMNA (0.46) AKR1B1LMNAL3MBTL1TDP1KDM4E
SCHEMBL27567929 0.69
SCHEMBL400738 0.69
E968 SCHEMBL2161824 0.67 AKR1B1 (0.47) AKR1B1LMNAL3MBTL1TDP1KDM4E
SCHEMBL11343452 0.67 ADH1B (0.44) AKR1B1LMNAL3MBTL1TDP1ADH1B
SCHEMBL18823383 0.65
SCHEMBL25094939 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109790409-A Copper ink and the conduction being made from it can weld copper tracing wire 加拿大国家研究委员会 2019-05-21 CN claimed