SCHEMBL283174

SCHEMBL283174

Nc1cccc(-c2cccc3c2Cc2ccccc2-3)c1N

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PNMT P11086 1/20 0.53
NPC1 O15118 2/20 0.44
RAB9A P51151 2/20 0.44
ALDH1A1 P00352 2/20 0.44
KDM4E B2RXH2 1/20 0.44
LMNA P02545 1/20 0.44
MAPT P10636 1/20 0.44
HPGD P15428 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
HTR7 P34969 1/20 0.43
HTR2B P41595 1/20 0.43
ACHE P22303 5/20 0.42
BCHE P06276 1/20 0.42
ADORA2A P29274 1/20 0.40
ADORA1 P30542 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.39
PGR P06401 1/20 0.38
MAOA P21397 1/20 0.38
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3630935 0.88 PNMT (0.56) PNMTNPC1RAB9AALDH1A1KDM4E
SCHEMBL21142139 0.86 PNMT (0.55) PNMTNPC1RAB9AALDH1A1KDM4E
SCHEMBL30497776 0.86 PNMT (0.58) PNMTNPC1RAB9AALDH1A1KDM4E
SCHEMBL221400 0.86 PNMT (0.58) PNMTNPC1RAB9AALDH1A1KDM4E
Hydrochloric Acid SCHEMBL2866030 0.84 PNMT (0.56) PNMTNPC1RAB9AALDH1A1KDM4E
Bromide SCHEMBL28349432 0.84 PNMT (0.56) PNMTNPC1RAB9AALDH1A1KDM4E
SCHEMBL524602 0.83 PNMT (0.63) PNMTNPC1RAB9AALDH1A1KDM4E
SCHEMBL30103334 0.83 PNMT (0.63) PNMTNPC1RAB9AALDH1A1KDM4E
SCHEMBL30297457 0.82 NPC1 (0.50) PNMTNPC1RAB9AALDH1A1KDM4E
SCHEMBL87731 0.82 NPC1 (0.50) PNMTNPC1RAB9AALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3778693-B1 CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT SUBSTRATE, INTERLAYER INSULATING MATERIAL, AND PRINTED WIRING BOARD SEKISUI CHEMICAL CO LTD (JP) 2025-09-17 EP disclosed
WO-2025095038-A1 RESIN WIRING SUBSTRATE AND STRETCHABLE DEVICE TDK株式会社 2025-05-08 WO disclosed
WO-2025095037-A1 RESIN WIRING BOARD AND STRETCHABLE DEVICE TDK株式会社 2025-05-08 WO disclosed
WO-2025063189-A1 ORGANIC EL DISPLAY DEVICE 東レ株式会社 2025-03-27 WO disclosed
US-12139576-B2 Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board SEKISUI CHEMICAL CO., LTD. (JP) 2024-11-12 US disclosed
WO-2024204339-A1 POSITIVE PHOTOSENSITIVE PIGMENT COMPOSITION, CURED PRODUCT, AND ORGANIC EL DISPLAY DEVICE 東レ株式会社 2024-10-03 WO disclosed
EP-4324895-A1 INSULATING RESIN SHEET, MULTILAYER BODY AND SEMICONDUCTOR DEVICE SEKISUI CHEMICAL CO., LTD. (JP) 2024-02-21 EP disclosed
EP-4324865-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE AGENT, AND ADHESIVE FILM SEKISUI CHEMICAL CO., LTD. (JP) 2024-02-21 EP disclosed
US-11885694-B2 Temperature sensor element SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2024-01-30 US disclosed
US-11802177-B2 Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent SEKISUI CHEMICAL CO., LTD. (JP) 2023-10-31 US disclosed
US-20130289203-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION CONTAINING SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-31 US disclosed
US-20130281620-A1 FILM-FORMING COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-24 US disclosed
EP-2636697-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION CONTAINING SAME Nissan Chemical Industries, Ltd. (JP) 2013-09-11 EP disclosed
EP-2636704-A1 FILM-FORMING COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2013-09-11 EP disclosed
EP-2628769-A1 FILM-FORMING COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2013-08-21 EP disclosed
US-20130154043-A1 FILM-FORMING COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-06-20 US disclosed
EP-2428529-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION COMPRISING SAME Nissan Chemical Industries, Ltd. (JP) 2012-03-14 EP disclosed
US-20120049308-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION COMPRISING SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-03-01 US disclosed
CN-1211418-C Photocrosslinkable polyimides ROLIC AG (CH) 2005-07-20 CN disclosed
CN-1271370-A Photocrosslinkable polyimides ROLIC AG (CH) 2000-10-25 CN disclosed