Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PNMT | P11086 | 1/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.54 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.54 |
| ▸ | NPC1 | O15118 | 2/20 | 0.47 |
| ▸ | RAB9A | P51151 | 2/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.47 |
| ▸ | LMNA | P02545 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.47 |
| ▸ | HPGD | P15428 | 1/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.47 |
| ▸ | HTR7 | P34969 | 1/20 | 0.45 |
| ▸ | HTR2B | P41595 | 1/20 | 0.45 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.42 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.41 |
| ▸ | ACHE | P22303 | 3/20 | 0.41 |
| ▸ | BCHE | P06276 | 2/20 | 0.41 |
| ▸ | MAOA | P21397 | 1/20 | 0.40 |
| ▸ | CA1 | P00915 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21142139 | 0.98 | PNMT (0.55) | PNMTALDH1A1L3MBTL1NPC1RAB9A | |
| SCHEMBL221400 | 0.89 | PNMT (0.58) | PNMTALDH1A1L3MBTL1NPC1RAB9A | |
| SCHEMBL30497776 | 0.89 | PNMT (0.58) | PNMTALDH1A1L3MBTL1NPC1RAB9A | |
| SCHEMBL283174 | 0.88 | PNMT (0.53) | PNMTALDH1A1L3MBTL1NPC1RAB9A | |
| Bromide SCHEMBL28349432 | 0.88 | PNMT (0.56) | PNMTALDH1A1L3MBTL1NPC1RAB9A | |
| Hydrochloric Acid SCHEMBL2866030 | 0.88 | PNMT (0.56) | PNMTALDH1A1L3MBTL1NPC1RAB9A | |
| SCHEMBL524602 | 0.87 | PNMT (0.63) | PNMTALDH1A1NPC1RAB9AKDM4E | |
| SCHEMBL30103334 | 0.87 | PNMT (0.63) | PNMTALDH1A1NPC1RAB9AKDM4E | |
| SCHEMBL5160246 | 0.85 | ALDH1A1 (0.46) | PNMTALDH1A1L3MBTL1NPC1RAB9A | |
| SCHEMBL2877998 | 0.84 | PNMT (0.61) | PNMTALDH1A1NPC1RAB9AKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110114384-B | Curable composition | 3M创新有限公司 | 2022-06-07 | — | — | CN | claimed |
| CN-113165147-A | Fast curing bonded abrasive article precursor | 3M创新有限公司 | 2021-07-23 | — | — | CN | claimed |
| CN-112313262-A | Curable compositions and related methods | 3M创新有限公司 | 2021-02-02 | — | — | CN | claimed |
| CN-110997748-A | Curable composition comprising an epoxy resin and a curable solid filler | 3M创新有限公司 | 2020-04-10 | — | — | CN | claimed |
| EP-2900726-B1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LTD (GB) | 2020-04-08 | — | — | EP | claimed |
| CN-102143987-B | Heat-cured epoxy resin composition | YOKOHAMA RUBBER CO LTD | 2013-08-21 | — | — | CN | claimed |
| CN-101935512-A | Reactive hot melt adhesive with improved hydrolysis resistance | NAT STARCH CHEM INVEST | 2011-01-05 | — | — | CN | claimed |
| EP-1407463-A2 | CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES | 3M Innovative Properties Company (US) | 2004-04-14 | — | — | EP | claimed |
| US-6577492-B2 | Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer | 3M INNOVATIVE PROPERTIES COMPANY | 2003-06-10 | — | — | US | claimed |
| US-20030030966-A1 | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes | 3M INNOVATIVE PROPERTIES COMPANY | 2003-02-13 | — | — | US | claimed |
| WO-2003007319-A2 | CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2003-01-23 | — | — | WO | claimed |
| US-5541000-A | Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1996-07-30 | — | — | US | claimed |
| EP-0203828-B1 | EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1990-03-28 | — | — | EP | claimed |
| US-4684678-A | POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-08-04 | — | — | US | claimed |
| EP-0203828-A1 | Epoxy resin curing agent, curing process and composition containing it | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1986-12-03 | — | — | EP | claimed |
| CN-113549217-B | Polyimide precursor, resin composition containing same, polyimide resin film, and method for producing same | 旭化成株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-117120516-A | Polyimide, resin composition, polyimide film, and method for producing same | 旭化成株式会社 | 2023-11-24 | — | — | CN | disclosed |
| EP-0203828-B1 | EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1990-03-28 | — | — | EP | disclosed |
| US-4684678-A | POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-08-04 | — | — | US | disclosed |
| EP-0203828-A1 | Epoxy resin curing agent, curing process and composition containing it | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1986-12-03 | — | — | EP | disclosed |