Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2D6 | P10635 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7363130 | 0.78 | CYP2D6 (0.47) | CYP2D6 | |
| SCHEMBL18534234 | 0.73 | CYP2D6 (0.33) | CYP2D6 | |
| SCHEMBL19366050 | 0.70 | CYP2D6 (0.32) | CYP2D6 | |
| SCHEMBL8374355 | 0.68 | ALDH1A1 (0.38) | — | |
| SCHEMBL869120 | 0.67 | LMNA (0.34) | — | |
| SCHEMBL99777 | 0.67 | SERPINE1 (0.34) | — | |
| SCHEMBL28449210 | 0.67 | — | — | |
| SCHEMBL8499849 | 0.66 | — | — | |
| SCHEMBL5898830 | 0.66 | — | — | |
| SCHEMBL690378 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |
| CN-114269848-B | Composition for forming heat conductive material, heat conductive sheet, and device with heat conductive layer | 富士胶片株式会社 | 2024-07-16 | — | — | CN | disclosed |
| CN-114846032-B | Radical polymerizable resin composition and cured product thereof | 株式会社力森诺科 | 2024-06-18 | — | — | CN | disclosed |
| CN-117487403-A | Quantum dot ink and application thereof | 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) | 2024-02-02 | — | — | CN | disclosed |
| CN-117136175-A | Recess filling material kit, cured product thereof, and recess filling method | 株式会社力森诺科 | 2023-11-28 | — | — | CN | disclosed |
| CN-116917249-A | Recess filling material kit, cured product thereof, and recess filling method | 株式会社力森诺科 | 2023-10-20 | — | — | CN | disclosed |
| EP-3891210-B1 | MULTI-COMPONENT SYSTEMS FOR PREPARING FOAMED PRODUCTS | ARKEMA FRANCE (FR) | 2023-08-23 | — | — | EP | disclosed |
| US-20230099722-A1 | COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER | FUJIFILM CORPORATION (JP) | 2023-03-30 | — | — | US | disclosed |
| WO-2022224989-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND METHOD FOR FILLING RECESS | 昭和電工株式会社 | 2022-10-27 | — | — | WO | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |
| US-20100210812-A1 | CURABLE COMPOSITION AND CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2010-08-19 | — | — | US | disclosed |
| US-20100087611-A1 | URETHANE COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2010-04-08 | — | — | US | disclosed |
| EP-2172509-A1 | CURABLE COMPOSITION AND CURED PRODUCT THEREOF | Showa Denko K.K. (JP) | 2010-04-07 | — | — | EP | disclosed |
| EP-2143739-A1 | URETHANE COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT OF THE COMPOSITION | Showa Denko K.K. (JP) | 2010-01-13 | — | — | EP | disclosed |
| US-20090023831-A1 | Curable Composition Containing Thiol Compound | SHOWA DENKO K.K. (JP) | 2009-01-22 | — | — | US | disclosed |
| EP-1983017-A1 | CURABLE COMPOSITION CONTAINING THIOL COMPOUND | Showa Denko K.K. (JP) | 2008-10-22 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20100087611-A1 | URETHANE COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT THEREOF | ITCH, GLI1, UNC119 | CYP2D6 3918/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.