Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.34 |
| ▸ | HTR2C | P28335 | 1/20 | 0.33 |
| ▸ | RAB9A | P51151 | 2/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | NISCH | Q9Y2I1 | 1/20 | 0.31 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.31 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.31 |
| ▸ | SLC22A3 | O75751 | 1/20 | 0.31 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.30 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL526305 | 0.98 | ALDH1A1 (0.38) | ALDH1A1SIGMAR1HTR2CRAB9ANPC1 | |
| Water SCHEMBL27277454 | 0.95 | ALDH1A1 (0.36) | ALDH1A1SIGMAR1HTR2CRAB9ANPC1 | |
| SCHEMBL11005839 | 0.95 | SIGMAR1 (0.39) | ALDH1A1SIGMAR1HTR2CRAB9ANPC1 | |
| SCHEMBL1116101 | 0.95 | ALDH1A1 (0.36) | ALDH1A1SIGMAR1HTR2CRAB9ANPC1 | |
| SCHEMBL9142445 | 0.95 | ALDH1A1 (0.36) | ALDH1A1SIGMAR1HTR2CRAB9ANPC1 | |
| SCHEMBL9143605 | 0.95 | ALDH1A1 (0.36) | ALDH1A1SIGMAR1HTR2CRAB9ANPC1 | |
| SCHEMBL28270415 | 0.93 | ALDH1A1 (0.41) | ALDH1A1RAB9ANPC1SLC22A2SLC22A1 | |
| Biphenyl SCHEMBL27702269 | 0.88 | ALDH1A1 (0.45) | ALDH1A1RAB9ANPC1NISCHSLC22A2 | |
| Biphenyl SCHEMBL27484108 | 0.83 | KMO (0.42) | ALDH1A1NPC1NISCHSLC6A4 | |
| SCHEMBL27336597 | 0.80 | SLC6A2 (0.39) | ALDH1A1NISCHSLC6A4HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113614130-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-113168093-B | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-117940516-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-04-26 | — | — | CN | disclosed |
| CN-117881745-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and compound | 富士胶片株式会社 | 2024-04-12 | — | — | CN | disclosed |
| CN-117836916-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, treatment liquid, and resin composition | 富士胶片株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117836715-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and alkali generator | 富士胶片株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117751326-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device | 富士胶片株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-117730280-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device | 富士胶片株式会社 | 2024-03-19 | — | — | CN | disclosed |
| CN-117715982-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-03-15 | — | — | CN | disclosed |
| CN-117642442-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-03-01 | — | — | CN | disclosed |
| CN-112752798-A | Resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-112639615-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, semiconductor element, and thermoalcogenating agent | 富士胶片株式会社 | 2021-04-09 | — | — | CN | disclosed |
| CN-112639616-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-04-09 | — | — | CN | disclosed |
| CN-112513219-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-03-16 | — | — | CN | disclosed |
| CN-112004887-A | Heat conductive layer, photosensitive composition, method for producing heat conductive layer, laminate, and semiconductor device | 富士胶片株式会社 | 2020-11-27 | — | — | CN | disclosed |
| CN-111936930-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2020-11-13 | — | — | CN | disclosed |
| CN-111919172-A | Photosensitive resin composition, cured film, laminate, method for producing same, semiconductor device, and thermal alkali generator used for same | 富士胶片株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111819306-A | Method for producing film, method for producing laminate, method for producing semiconductor device, and composition for film formation | 富士胶片株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-110741318-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, semiconductor device, and compound | 富士胶片株式会社 | 2020-01-31 | — | — | CN | disclosed |
| CN-110692018-A | Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2020-01-14 | — | — | CN | disclosed |