Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.34 |
| ▸ | ATM | Q13315 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | RECQL | P46063 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.32 |
| ▸ | SCN10A | Q9Y5Y9 | 1/20 | 0.31 |
| ▸ | THRA | P10827 | 1/20 | 0.31 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
| ▸ | ESR1 | P03372 | 1/20 | 0.31 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.31 |
| ▸ | APEX1 | P27695 | 1/20 | 0.30 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | HTT | P42858 | 1/20 | 0.30 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11260156 | 1.00 | L3MBTL1 (0.34) | L3MBTL1ATMKDM4EGAASMN1; SMN2 | |
| SCHEMBL28349819 | 0.88 | L3MBTL1 (0.33) | L3MBTL1ATMKDM4EGAASMN1; SMN2 | |
| SCHEMBL750445 | 0.88 | ATM (0.34) | L3MBTL1ATMKDM4EGAASMN1; SMN2 | |
| SCHEMBL9294353 | 0.88 | ATM (0.34) | L3MBTL1ATMKDM4EGAASMN1; SMN2 | |
| SCHEMBL2710797 | 0.86 | THRA (0.41) | KDM4EGAASMN1; SMN2RECQLMAPT | |
| SCHEMBL7954050 | 0.86 | THRA (0.41) | KDM4EGAASMN1; SMN2RECQLMAPT | |
| SCHEMBL2925233 | 0.86 | THRA (0.41) | KDM4EGAASMN1; SMN2RECQLMAPT | |
| SCHEMBL19026571 | 0.86 | THRA (0.41) | KDM4EGAASMN1; SMN2RECQLMAPT | |
| SCHEMBL7951307 | 0.86 | THRA (0.41) | KDM4EGAASMN1; SMN2RECQLMAPT | |
| SCHEMBL7948647 | 0.86 | THRA (0.41) | KDM4EGAASMN1; SMN2RECQLMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111961318-B | Enhanced PBT resin composition, preparation method thereof and precipitation detection method | 珠海格力绿色再生资源有限公司 | 2022-12-16 | — | — | CN | claimed |
| CN-112391046-A | Polycarbonate composite material and preparation method and application thereof | 武汉金发科技有限公司 | 2021-02-23 | — | — | CN | claimed |
| CN-111961318-A | Enhanced PBT resin composition, preparation method thereof and precipitation detection method | 珠海格力绿色再生资源有限公司 | 2020-11-20 | — | — | CN | claimed |
| CN-111909638-A | Temporary bonding adhesive material for preventing wafer from being damaged by ultraviolet laser | 深圳先进电子材料国际创新研究院 | 2020-11-10 | — | — | CN | claimed |
| CN-115926387-A | Multicolor PET film material and preparation method thereof | 昆山惠士德新材料有限公司 | 2023-04-07 | — | — | CN | disclosed |
| CN-115895507-A | EVA hot melt adhesive for surface veneering of wood board and preparation process thereof | 上海路嘉胶粘剂有限公司 | 2023-04-04 | — | — | CN | disclosed |
| CN-111961318-B | Enhanced PBT resin composition, preparation method thereof and precipitation detection method | 珠海格力绿色再生资源有限公司 | 2022-12-16 | — | — | CN | disclosed |
| CN-115322695-A | High-performance degradable adhesive tape and preparation method thereof | 永大（中山）有限公司 | 2022-11-11 | — | — | CN | disclosed |
| CN-115216260-A | Environment-friendly strongly-adhesive hot melt adhesive for SPC floor mute mat and preparation method thereof | 江苏鸿泰锦新材料有限公司 | 2022-10-21 | — | — | CN | disclosed |
| CN-112391046-A | Polycarbonate composite material and preparation method and application thereof | 武汉金发科技有限公司 | 2021-02-23 | — | — | CN | disclosed |
| CN-111961318-A | Enhanced PBT resin composition, preparation method thereof and precipitation detection method | 珠海格力绿色再生资源有限公司 | 2020-11-20 | — | — | CN | disclosed |
| CN-111909638-A | Temporary bonding adhesive material for preventing wafer from being damaged by ultraviolet laser | 深圳先进电子材料国际创新研究院 | 2020-11-10 | — | — | CN | disclosed |
| CN-106634805-B | High-temperature and high-humidity resistant organic silicon adhesive | 广州市白云化工实业有限公司 | 2020-01-31 | — | — | CN | disclosed |