SCHEMBL28354375

SCHEMBL28354375

Nc1cccc(-n2ccnc2-c2ccccc2)c1

nearest known ligand 0.54

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KDR P35968 10/20 0.54
MAPK9 P45984 1/20 0.52
MAPK10 P53779 1/20 0.52
TSHR P16473 1/20 0.47
MAPT P10636 2/20 0.44
MAOA P21397 1/20 0.44
FLT1 P17948 2/20 0.44
FLT4 P35916 2/20 0.44
ASIC3 Q9UHC3 1/20 0.42
KDM4E B2RXH2 1/20 0.42
MEN1 O00255 1/20 0.42
ALDH1A1 P00352 1/20 0.42
ALOX15 P16050 1/20 0.42
CASP1 P29466 1/20 0.42
CASP7 P55210 1/20 0.42
KMT2A Q03164 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.41
TNK2 Q07912 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15089107 0.92 MAOA (0.47) KDRMAPK9MAPK10TSHRMAPT
SCHEMBL528245 0.84 MAPK9 (0.54) KDRMAPK9MAPK10FLT1FLT4
Benzene SCHEMBL27839441 0.84 MAPK9 (0.54) KDRMAPK9MAPK10FLT1FLT4
SCHEMBL23016354 0.84 KDR (0.58) KDRMAPK9MAPK10MAPTMAOA
SCHEMBL17743635 0.83 MAPK9 (0.51) KDRMAPK9MAPK10FLT1FLT4
SCHEMBL22453137 0.83 MAPK9 (0.48) KDRMAPK9MAPK10TSHRFLT1
Hydrochloric Acid SCHEMBL27683877 0.83 MAPK9 (0.53) KDRMAPK9MAPK10FLT1FLT4
SCHEMBL23382223 0.83 OPRD1 (0.57) KDRMAPK9MAPK10MAPTFLT1
SCHEMBL23382222 0.80 KDR (0.59) KDRMAPK9MAPK10MAPTFLT1
SCHEMBL30878105 0.80 KDR (0.59) KDRMAPK9MAPK10MAPTFLT1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110776657-B High-thermal-conductivity polyimide film and preparation method thereof 株洲时代华鑫新材料技术有限公司 2022-02-11 CN claimed
CN-110776657-A High-thermal-conductivity polyimide film and preparation method thereof 株洲时代新材料科技股份有限公司 2020-02-11 CN claimed
CN-110776657-B High-thermal-conductivity polyimide film and preparation method thereof 株洲时代华鑫新材料技术有限公司 2022-02-11 CN disclosed
CN-110776657-A High-thermal-conductivity polyimide film and preparation method thereof 株洲时代新材料科技股份有限公司 2020-02-11 CN disclosed