Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 6/20 | 0.45 |
| ▸ | THRA | P10827 | 4/20 | 0.45 |
| ▸ | PPARA | Q07869 | 2/20 | 0.42 |
| ▸ | PPARG | P37231 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | S1PR1 | P21453 | 4/20 | 0.37 |
| ▸ | S1PR2 | O95136 | 2/20 | 0.37 |
| ▸ | S1PR4 | O95977 | 2/20 | 0.37 |
| ▸ | S1PR5 | Q9H228 | 2/20 | 0.37 |
| ▸ | S1PR3 | Q99500 | 1/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28818382 | 0.95 | THRB (0.43) | THRBTHRAPPARAPPARGALDH1A1 | |
| SCHEMBL29007047 | 0.92 | THRB (0.41) | THRBTHRAPPARAPPARGTSHR | |
| SCHEMBL30519410 | 0.89 | THRB (0.43) | THRBTHRAPPARAPPARGS1PR1 | |
| SCHEMBL8515774 | 0.89 | THRB (0.43) | THRBTHRAPPARAPPARGS1PR1 | |
| SCHEMBL11967010 | 0.86 | GAA (0.42) | THRBTHRAPPARAPPARGTSHR | |
| SCHEMBL11967008 | 0.86 | GAA (0.42) | THRBTHRAPPARAPPARGTSHR | |
| SCHEMBL27758222 | 0.86 | THRB (0.46) | THRBTHRAPPARAPPARGALDH1A1 | |
| SCHEMBL11967011 | 0.85 | L3MBTL1 (0.41) | THRBTHRAPPARAPPARGTSHR | |
| SCHEMBL14701748 | 0.84 | PPARG (0.38) | THRBTHRAPPARAPPARGTSHR | |
| SCHEMBL28678913 | 0.84 | POLB (0.48) | TSHRKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116981996-A | Transfer film, method for producing laminate, and method for producing circuit wiring | 富士胶片株式会社 | 2023-10-31 | — | — | CN | disclosed |
| CN-116917122-A | Transfer film and method for producing conductor pattern | 富士胶片株式会社 | 2023-10-20 | — | — | CN | disclosed |
| CN-116802558-A | Method for producing laminated body, method for producing circuit wiring, method for producing electronic device, and photosensitive transfer material | 富士胶片株式会社 | 2023-09-22 | — | — | CN | disclosed |
| CN-116745697-A | Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, and method for producing touch panel | 富士胶片株式会社 | 2023-09-12 | — | — | CN | disclosed |
| CN-116670593-A | Method for producing laminate, method for producing circuit wiring, and transfer film | 富士胶片株式会社 | 2023-08-29 | — | — | CN | disclosed |
| CN-116670588-A | Photosensitive transfer material, method for producing resin pattern, method for producing laminate, method for producing circuit wiring, and method for producing electronic device | 富士胶片株式会社 | 2023-08-29 | — | — | CN | disclosed |
| CN-116635790-A | Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, method for producing electronic device, and method for producing laminate | 富士胶片株式会社 | 2023-08-22 | — | — | CN | disclosed |
| CN-116601566-A | Photosensitive transfer material, method for producing resin pattern, method for producing laminate, method for producing circuit wiring, and method for producing electronic device | 富士胶片株式会社 | 2023-08-15 | — | — | CN | disclosed |
| CN-116472494-A | Method for producing laminate, method for producing circuit wiring board, and transfer film | 富士胶片株式会社 | 2023-07-21 | — | — | CN | disclosed |
| CN-116324619-A | Information providing method, method for manufacturing resin pattern, method for manufacturing circuit wiring, and method for manufacturing touch panel | 富士胶片株式会社 | 2023-06-23 | — | — | CN | disclosed |
| CN-110161802-B | Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2022-08-23 | — | — | CN | disclosed |
| CN-114901442-A | Method for producing dicing material, and laminate | 富士胶片株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114855119-A | Method for manufacturing metal mask | 昭和电工材料株式会社 | 2022-08-05 | — | — | CN | disclosed |
| CN-114270262-A | Photosensitive transfer member, method for manufacturing circuit wiring, and method for manufacturing touch panel | 富士胶片株式会社 | 2022-04-01 | — | — | CN | disclosed |
| CN-107924130-B | Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2022-01-14 | — | — | CN | disclosed |
| CN-113156767-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2021-07-23 | — | — | CN | disclosed |
| CN-110225665-B | Photosensitive element | 昭和电工材料株式会社 | 2021-04-06 | — | — | CN | disclosed |
| CN-107077068-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2021-03-12 | — | — | CN | disclosed |
| CN-104781730-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 日立化成株式会社 | 2020-03-06 | — | — | CN | disclosed |
| CN-104834184-B | Photosensitive element | 日立化成株式会社 | 2019-12-31 | — | — | CN | disclosed |