SCHEMBL28400754

SCHEMBL28400754

Clc1cc(Cl)cc(-c2c[nH]c(Cc3cccnc3)n2)c1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HRH4 Q9H3N8 2/20 0.44
HRH3 Q9Y5N1 2/20 0.44
CCNB2 O95067 1/20 0.40
CCNE2 O96020 1/20 0.40
CDK1 P06493 1/20 0.40
CDK4 P11802 1/20 0.40
CCNB1 P14635 1/20 0.40
CCND1 P24385 1/20 0.40
CCNE1 P24864 1/20 0.40
CDK2 P24941 1/20 0.40
CCNB3 Q8WWL7 1/20 0.40
P2RX7 Q99572 1/20 0.39
PSD A5PKW4 2/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
NPY5R Q15761 1/20 0.39
MAPT P10636 1/20 0.39
MAPK1 P28482 1/20 0.39
CYP11B1 P15538 1/20 0.39
CYP11B2 P19099 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28889070 0.86 P2RX7 (0.49) HRH4HRH3P2RX7MEN1KMT2A
SCHEMBL26110472 0.85 CXCR2 (0.45) HRH3CCNE2CDK4CCND1CCNE1
SCHEMBL28406405 0.83 GSK3B (0.41) HRH4HRH3CCNB2CCNE2CDK1
SCHEMBL28397996 0.83 CYP11B1 (0.56) HRH4HRH3P2RX7MAPTCYP11B1
SCHEMBL28406033 0.83 HRH4 (0.46) HRH4HRH3CCNB2CCNE2CDK1
SCHEMBL27967854 0.81 CXCR2 (0.33)
SCHEMBL28398751 0.81 P2RX7 (0.44) HRH4HRH3CCNB2CCNE2CDK1
SCHEMBL28399044 0.81 P2RX7 (0.49) HRH4HRH3CCNB2CCNE2CDK1
SCHEMBL2865654 0.80 NR1H2 (0.39) KMT2AMAPTMAPK1
SCHEMBL28889081 0.78 NPY5R (0.52) HRH4HRH3CCNB2CCNE2CDK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111057043-A Imidazole compound, preparation method and application thereof, organic weldable protective agent containing imidazole compound and surface treatment method 深圳市贝加电子材料有限公司 2020-04-24 CN claimed