SCHEMBL28401167

SCHEMBL28401167

CCC(c1ccc(-c2ccc(C(=O)O)c(C(=O)O)c2)cc1)c1ccc(-c2ccc(C(=O)O)c(C(=O)O)c2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP17A1 P05093 2/20 0.47
MCL1 Q07820 3/20 0.46
KMT2A Q03164 2/20 0.46
MEN1 O00255 1/20 0.46
CYP2D6 P10635 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
HSD17B10 Q99714 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
GRM8 O00222 1/20 0.46
GRM6 O15303 1/20 0.46
SLC6A2 P23975 1/20 0.46
SLC6A4 P31645 1/20 0.46
DRD3 P35462 1/20 0.46
GRM4 Q14833 1/20 0.46
ACMSD Q8TDX5 3/20 0.43
HNF4A P41235 2/20 0.43
DHFR P00374 1/20 0.43
KDM4E B2RXH2 1/20 0.43
GFER P55789 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL254345 0.85 HSD17B10 (0.56) KMT2AMEN1CYP2D6CYP2C9CYP2C19
SCHEMBL31473042 0.85 HSD17B10 (0.56) KMT2AMEN1CYP2D6CYP2C9CYP2C19
SCHEMBL7071489 0.83 HSD17B10 (0.50) KMT2AMEN1CYP2D6CYP2C9CYP2C19
Butane SCHEMBL15105387 0.81 MCL1 (0.54) MCL1KMT2AACMSDHNF4ADHFR
SCHEMBL29436303 0.81 KMT2A (0.60) MCL1KMT2AMEN1CYP2D6CYP2C9
SCHEMBL710222 0.81 KMT2A (0.60) MCL1KMT2AMEN1CYP2D6CYP2C9
SCHEMBL9550353 0.81 KMT2A (0.60) MCL1KMT2AMEN1CYP2D6CYP2C9
SCHEMBL2114613 0.80 KLKB1 (0.50) KMT2AMEN1CYP2D6CYP2C9CYP2C19
SCHEMBL28720485 0.79 HSD17B10 (0.50) CYP17A1KMT2AMEN1CYP2D6CYP2C9
SCHEMBL351082 0.79 POLB (0.55) MCL1KMT2AMEN1CYP2D6CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111344351-B Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor 三井金属矿业株式会社 2024-02-09 CN disclosed
CN-115023348-A Resin laminate, dielectric layer, metal foil with resin, capacitor element, and capacitor-embedded printed wiring board 三井金属矿业株式会社 2022-09-06 CN disclosed
CN-111201277-B Resin composition for printed wiring board, copper foil with resin, copper-clad laminate, and printed wiring board 三井金属矿业株式会社 2021-12-03 CN disclosed
CN-107848260-B Copper foil with resin, copper-clad laminate, and printed wiring board 三井金属矿业株式会社 2020-10-30 CN disclosed
CN-111344351-A Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and capacitor-embedded printed wiring board 三井金属矿业株式会社 2020-06-26 CN disclosed
CN-111201277-A Resin composition for printed wiring board, copper foil with resin, copper-clad laminate, and printed wiring board 三井金属矿业株式会社 2020-05-26 CN disclosed