Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | ESR1 | P03372 | 1/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28711287 | 0.86 | ALDH1A1 (0.39) | ALDH1A1 | |
| SCHEMBL28473928 | 0.79 | ALDH1A1 (0.37) | ALDH1A1 | |
| SCHEMBL28404699 | 0.78 | ALDH1A1 (0.35) | ALDH1A1 | |
| SCHEMBL28655713 | 0.75 | ALDH1A1 (0.41) | ALDH1A1ESR1SMN1; SMN2 | |
| SCHEMBL28695866 | 0.73 | ALDH1A1 (0.39) | ALDH1A1 | |
| Mellitic Acid SCHEMBL28628589 | 0.71 | ESR1 (0.41) | ESR1SMN1; SMN2 | |
| SCHEMBL10528301 | 0.63 | TSHR (0.53) | ALDH1A1ESR1TP53SMN1; SMN2 | |
| SCHEMBL1344032 | 0.63 | TSHR (0.53) | ALDH1A1ESR1TP53SMN1; SMN2 | |
| SCHEMBL10430718 | 0.62 | ALDH1A1 (0.55) | ALDH1A1ESR1 | |
| SCHEMBL10430714 | 0.61 | ALDH1A1 (0.47) | ALDH1A1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102382421-B | Liquid epoxy resin packaging material and preparation method thereof | SHANTOU JUNMAKAISA CO LTD | 2015-06-24 | — | — | CN | claimed |
| CN-101948672-B | High-defoaming epoxy resin packaging material and preparation method thereof | SHANTOU JUNMA KAISA CO LTD | 2013-03-06 | — | — | CN | claimed |
| CN-102382421-A | Liquid epoxy resin packaging material and preparation method thereof | SHANTOU JUNMAKAISA CO LTD | 2012-03-21 | — | — | CN | claimed |
| CN-101948672-A | High-defoaming epoxy resin packaging material and preparation method thereof | SHANTOU JUNMA KAISA CO LTD | 2011-01-19 | — | — | CN | claimed |
| CN-111278639-B | Laminated film and method for producing laminated film | 积水化学工业株式会社 | 2022-06-24 | — | — | CN | disclosed |
| CN-110088163-B | Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using same | 三菱化学株式会社 | 2022-06-14 | — | — | CN | disclosed |
| CN-114072444-A | Curable composition, cured product, overcoat film, flexible wiring board, and method for producing same | 日保丽公司 | 2022-02-18 | — | — | CN | disclosed |
| CN-109075088-B | Method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-01-07 | — | — | CN | disclosed |
| CN-113755111-A | Substrate film for dicing tape and dicing tape | 麦克赛尔株式会社 | 2021-12-07 | — | — | CN | disclosed |
| CN-113733688-A | Laminate | 积水化学工业株式会社 | 2021-12-03 | — | — | CN | disclosed |
| CN-113228237-A | Method for evaluating photocurable pressure-sensitive adhesive, dicing die-bonding integrated film and method for producing same, and method for producing semiconductor device | 昭和电工材料株式会社 | 2021-08-06 | — | — | CN | disclosed |
| CN-113059875-A | Laminate | 积水化学工业株式会社 | 2021-07-02 | — | — | CN | disclosed |
| CN-102388013-B | Chlorobenzene derivative, optically isotropic liquid crystal medium, and optical element | JNC CORP | 2014-09-17 | — | — | CN | disclosed |
| CN-103849118-A | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD | SAMSUNG ELECTRO MECH | 2014-06-11 | — | — | CN | disclosed |
| CN-103834138-A | Resin composition for printed circuit board, insulating film, prepreg and printed circuit board | SAMSUNG ELECTRO MECH | 2014-06-04 | — | — | CN | disclosed |
| CN-101948672-B | High-defoaming epoxy resin packaging material and preparation method thereof | SHANTOU JUNMA KAISA CO LTD | 2013-03-06 | — | — | CN | disclosed |
| CN-102812099-A | Liquid adhesive for electronic parts and adhesive tape | TOMOEGAWA CO LTD | 2012-12-05 | — | — | CN | disclosed |
| CN-102388013-A | Chlorobenzene derivative, optically isotropic liquid crystal medium, and optical element | JNC CORP | 2012-03-21 | — | — | CN | disclosed |
| CN-102237259-A | Belt for wafer processing | FURUKAWA ELECTRIC CO LTD | 2011-11-09 | — | — | CN | disclosed |
| CN-101948672-A | High-defoaming epoxy resin packaging material and preparation method thereof | SHANTOU JUNMA KAISA CO LTD | 2011-01-19 | — | — | CN | disclosed |