SCHEMBL2841961

SCHEMBL2841961

CCCCCOOC(=O)C(C)C

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.45
EPHX1 P07099 1/20 0.42
TSHR P16473 3/20 0.41
DGKA P23743 1/20 0.41
HCAR2 Q8TDS4 2/20 0.40
ALDH1A1 P00352 1/20 0.40
CES2 O00748 1/20 0.39
TP53 P04637 1/20 0.39
CYP3A4 P08684 1/20 0.39
MAPK1 P28482 1/20 0.39
MAPT P10636 1/20 0.39
RAD52 P43351 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
LMNA P02545 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28001750 0.98 NAAA (0.48) NAAAEPHX1TSHRDGKAHCAR2
SCHEMBL834402 0.94 ALDH1A1 (0.46) NAAAEPHX1TSHRDGKAHCAR2
SCHEMBL2517265 0.92 ALDH1A1 (0.45) NAAAEPHX1TSHRDGKAHCAR2
SCHEMBL5075330 0.88 NAAA (0.42) NAAAEPHX1TSHRDGKAHCAR2
SCHEMBL4675609 0.86 NAAA (0.44) NAAAEPHX1TSHRDGKAHCAR2
SCHEMBL2512732 0.85 CA1 (0.40) NAAATSHRDGKAHCAR2ALDH1A1
SCHEMBL4673156 0.84 NAAA (0.47) NAAAEPHX1TSHRDGKAHCAR2
SCHEMBL2520372 0.83 ALDH1A1 (0.33) NAAATSHRDGKAHCAR2ALDH1A1
SCHEMBL28292456 0.82 CA1 (0.50) NAAAEPHX1TSHRDGKA
SCHEMBL2553043 0.82 ALDH1A1 (0.43) NAAAEPHX1TSHRDGKAHCAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240059933-A1 An Encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly HANGZHOU FIRST APPLIED MAT CO LTD (CN) 2024-02-22 US claimed
EP-4206294-A1 ENCAPSULATING COMPOSITION, COMPOSITION, ENCAPSULATING GLUE FILM, ELECTRONIC COMPONENT AND SOLAR CELL ASSEMBLY Hangzhou First Applied Material Co., Ltd. (CN) 2023-07-05 EP claimed
US-20240059933-A1 An Encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly HANGZHOU FIRST APPLIED MAT CO LTD (CN) 2024-02-22 US disclosed
WO-2023132102-A1 STATOR OF ROTARY ELECTRIC MACHINE 日立Astemo株式会社 2023-07-13 WO disclosed
EP-4206294-A1 ENCAPSULATING COMPOSITION, COMPOSITION, ENCAPSULATING GLUE FILM, ELECTRONIC COMPONENT AND SOLAR CELL ASSEMBLY Hangzhou First Applied Material Co., Ltd. (CN) 2023-07-05 EP disclosed
WO-2022054381-A1 INSULATION PAPER, STATOR FOR ROTARY ELECTRIC MACHINE, AND ROTARY ELECTRIC MACHINE 日立Astemo株式会社 2022-03-17 WO disclosed
US-20110316661-A1 UNSATURATED POLYESTER RESIN COMPOSITION FOR COIL ADHESION HITACHI, LTD. (JP) 2011-12-29 US disclosed
US-20100156587-A1 THERMOSETTING RESIN COMPOSITION AND COIL FOR ELECTRIC MACHINE HITACHI, LTD. 2010-06-24 US disclosed
EP-2199311-A1 Thermosetting resin composition and coil for electric machine Hitachi Ltd. (JP) 2010-06-23 EP disclosed