SCHEMBL28421981

SCHEMBL28421981

CCC(C(=O)OO)C(C)(C)CC

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6296071 0.83 LMNA (0.37) CA1CA2TSHR
SCHEMBL7049139 0.83
SCHEMBL28292466 0.83 CA1 (0.44) CA1CA2
SCHEMBL1275780 0.82 TSHR (0.35) CA1CA2TSHR
SCHEMBL7119137 0.82 PGD (0.33)
SCHEMBL7119135 0.82 TSHR (0.31) TSHR
SCHEMBL8030299 0.80 CA2 (0.43) CA1CA2TSHR
SCHEMBL23794923 0.79
SCHEMBL3200021 0.78 CA1 (0.31) CA1CA2
SCHEMBL786910 0.77 USP2 (0.42) CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111394013-B Bi-component structural adhesive capable of being subjected to nondestructive testing, preparation method and application thereof, and electronic product 拓迪化学(上海)有限公司 2022-01-07 CN claimed
CN-109679310-B BMC material for direct current motor plastic package and preparation method thereof 绍兴金创意塑化电器有限公司 2022-01-28 CN disclosed
CN-111394013-B Bi-component structural adhesive capable of being subjected to nondestructive testing, preparation method and application thereof, and electronic product 拓迪化学(上海)有限公司 2022-01-07 CN disclosed
CN-109679311-B Microwave-resistant low-odor BMC material, preparation method and application thereof 绍兴金创意塑化电器有限公司 2021-05-04 CN disclosed
CN-111394013-A Bi-component structural adhesive capable of being subjected to nondestructive testing, preparation method and application thereof, and electronic product 拓迪化学(上海)有限公司 2020-07-10 CN disclosed