Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SHBG | P04278 | 1/20 | 0.45 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.33 |
| ▸ | ADRB2 | P07550 | 2/20 | 0.30 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.30 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.30 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.30 |
| ▸ | ESR1 | P03372 | 1/20 | 0.30 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.30 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11043796 | 0.85 | CA1 (0.39) | CYP1A2ESR1ESR2 | |
| SCHEMBL14616399 | 0.76 | SHBG (0.57) | SHBGS1PR1ADRB2CYP1A2CYP2D6 | |
| SCHEMBL8347004 | 0.74 | SHBG (0.55) | SHBGS1PR1CYP1A2CYP2D6ESR1 | |
| SCHEMBL28429155 | 0.73 | SHBG (0.46) | SHBGS1PR1CYP1A2CYP2D6ESR1 | |
| SCHEMBL25446769 | 0.71 | SHBG (0.52) | SHBGS1PR1ADRB2CYP1A2CYP2D6 | |
| SCHEMBL5303378 | 0.71 | SHBG (0.52) | SHBGS1PR1ADRB2CYP1A2CYP2D6 | |
| SCHEMBL19410100 | 0.71 | SHBG (0.52) | SHBGS1PR1CYP1A2CYP2D6ESR1 | |
| SCHEMBL7606337 | 0.71 | CYP3A4 (0.37) | — | |
| SCHEMBL7461092 | 0.71 | — | — | |
| SCHEMBL28454384 | 0.70 | ESR1 (0.41) | CYP1A2CYP2D6HIF1AESR1ESR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107077070-B | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | 东丽株式会社 | 2020-06-16 | — | — | CN | disclosed |