SCHEMBL19410100

SCHEMBL19410100

Cc1cc(C(c2cc(C)c(O)c(CO)c2)(C(F)(F)F)C(F)(F)F)cc(CO)c1O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.52
ESR1 P03372 2/20 0.38
ESR2 Q92731 2/20 0.38
KLF10 Q13118 1/20 0.38
CYP2C19 P33261 2/20 0.35
CYP1A2 P05177 1/20 0.35
CYP2D6 P10635 1/20 0.35
CYP2C9 P11712 1/20 0.35
LMNA P02545 2/20 0.33
HTT P42858 2/20 0.33
KDM4E B2RXH2 3/20 0.32
CASP6 P55212 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
S1PR1 P21453 1/20 0.31
MAOA P21397 1/20 0.31
ALDH1A1 P00352 2/20 0.31
HPGD P15428 2/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2466723 0.88 ESR1 (0.41) SHBGESR1ESR2KLF10CYP2C19
SCHEMBL19410118 0.82 PRKCE (0.41) SHBGESR1ESR2CYP2C19CYP1A2
SCHEMBL247818 0.82 ESR1 (0.48) ESR1ESR2CYP2C19CYP1A2CYP2D6
SCHEMBL28429155 0.80 SHBG (0.46) SHBGESR1ESR2KLF10CYP2C19
SCHEMBL15856231 0.80 IDO1 (0.41) SHBGESR1ESR2
SCHEMBL836696 0.79 SHBG (0.57) SHBGESR1ESR2KLF10CYP2C19
SCHEMBL31530701 0.79 SHBG (0.57) SHBGESR1ESR2KLF10CYP2C19
SCHEMBL11040770 0.79 SHBG (0.57) SHBGESR1ESR2KLF10CYP2C19
SCHEMBL19421990 0.78 PDE4A (0.40) ESR1ESR2KLF10LMNAKDM4E
SCHEMBL2466163 0.77 KLF10 (0.36) SHBGESR1ESR2KLF10CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10409163-B2 Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-09-10 US disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed