SCHEMBL28431024

SCHEMBL28431024

COCc1cc(C(F)(c2cc(COC)c(O)c(COC)c2)C(F)(F)C(F)(F)F)cc(COC)c1O

nearest known ligand 0.41

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
PRKCE Q02156 3/20 0.41
MYLK Q15746 2/20 0.41
MEN1 O00255 1/20 0.41
ALDH1A1 P00352 1/20 0.41
PRKCG P05129 1/20 0.41
MAPT P10636 1/20 0.41
PRKCA P17252 1/20 0.41
APEX1 P27695 1/20 0.41
RECQL P46063 1/20 0.41
KMT2A Q03164 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
CYP2C19 P33261 1/20 0.33
ALOX15 P16050 1/20 0.33
MAPK1 P28482 1/20 0.33
HTT P42858 1/20 0.33
PDK2 Q15119 1/20 0.31
KDM4E B2RXH2 1/20 0.30
CYP1A2 P05177 1/20 0.30
GLA P06280 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28420984 0.93 PRKCE (0.39) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL2469069 0.86 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL28423353 0.83 CYP2C19 (0.31) MAPTCYP2C19ALOX15MAPK1HTT
SCHEMBL2463085 0.82 PRKCE (0.43) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL28429812 0.78 KLF10 (0.36) CYP2C19ALOX15MAPK1HTTKDM4E
SCHEMBL19410118 0.76 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL10138161 0.76 PRKCE (0.47) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL8985932 0.76 ALOX15 (0.55) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL2114143 0.76 CYP2C19 (0.55) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL2837831 0.75 ESR1 (0.45) MEN1ALDH1A1MAPTKMT2ACYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107077070-B Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device 东丽株式会社 2020-06-16 CN disclosed