SCHEMBL2463085

SCHEMBL2463085

COCc1cc(C(c2cc(COC)c(O)c(COC)c2)(C(F)(F)F)C(F)(F)F)cc(COC)c1O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRKCE Q02156 3/20 0.43
MYLK Q15746 2/20 0.43
MEN1 O00255 1/20 0.43
ALDH1A1 P00352 1/20 0.43
PRKCG P05129 1/20 0.43
MAPT P10636 1/20 0.43
PRKCA P17252 1/20 0.43
APEX1 P27695 1/20 0.43
RECQL P46063 1/20 0.43
KMT2A Q03164 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ESR1 P03372 2/20 0.41
ESR2 Q92731 2/20 0.41
CYP2C19 P33261 1/20 0.34
ALOX15 P16050 1/20 0.34
MAPK1 P28482 1/20 0.34
HTT P42858 1/20 0.34
PDK2 Q15119 1/20 0.32
CYP1A2 P05177 2/20 0.32
KDM4E B2RXH2 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19410118 0.93 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL12937583 0.91 PRKCE (0.37) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL2469069 0.89 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL16229483 0.87 PRKCE (0.34) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL2605572 0.87 PRKCE (0.42) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL14997930 0.85 PRKCE (0.33) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL2466676 0.82 ESR1 (0.38) MAPTESR1ESR2CYP2C19ALOX15
SCHEMBL28431024 0.82 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL2469693 0.80 PTPN1 (0.40) ESR1ESR2CYP2C19ALOX15MAPK1
SCHEMBL2464772 0.80 ESR1 (0.36) PRKCEALDH1A1ESR1ESR2CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8852726-B2 Photosensitive polymer composition, method of producing pattern and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2014-10-07 US claimed
US-20120263920-A1 Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts OOE MASAYUKI (JP) 2012-10-18 US claimed
US-8231959-B2 Photosensitive polymer composition, method of producing pattern and electronic parts HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2012-07-31 US claimed
EP-1708026-B1 PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART HITACHI CHEM DUPONT MICROSYS (JP) 2011-10-05 EP claimed
US-20080220222-A1 Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-09-11 US claimed
EP-1708026-A1 PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART Hitachi Chemical DuPont Microsystems Ltd. (JP) 2006-10-04 EP claimed
CN-114436910-B Diazonaphthoquinone sulfonate compound and resin composition 北京鼎材科技有限公司 2024-01-26 CN disclosed
CN-111848954-B Modified polyimide precursor resin, photosensitive resin composition and application thereof 北京鼎材科技有限公司 2023-10-17 CN disclosed
US-11725076-B2 Polymer for formation of resist underlayer film, composition for formation of resist underlayer film comprising same and method for manufacturing semiconductor element by using same SK INNOVATION CO., LTD. (KR) 2023-08-15 US disclosed
US-11435667-B2 Polymer for organic bottom anti-reflective coating and bottom anti-reflective coatings comprising the same SK INNOVATION CO., LTD. (KR) 2022-09-06 US disclosed
US-20200199288-A1 Polymer For Formation of Resist Underlayer Film, Composition for Formation of Resist Underlayer Film Comprising Same and Method for Manufacturing Semiconductor Element by Using Same SK GEO CENTRIC CO., LTD. (KR) 2020-06-25 US disclosed
CN-107077070-B Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device 东丽株式会社 2020-06-16 CN disclosed
US-10409163-B2 Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-09-10 US disclosed
US-20110008730-A1 POSITIVE-TYPE RADIATION-SENSITIVE COMPOSITION, CURED FILM, INTERLAYER INSULATING FILM, METHOD OF FORMING INTERLAYER INSULATING FILM, DISPLAY DEVICE, AND SILOXANE POLYMER FOR FORMING INTERLAYER INSULATING FILM JSR CORPORATION (JP) 2011-01-13 US disclosed
US-20100266951-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-10-21 US disclosed
US-20100266951-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-10-21 US disclosed
US-20080220222-A1 Photosensitive Polymer Composition, Method of Producing Pattern and Electronic Parts HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-09-11 US disclosed
US-7374856-B2 Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film TORAY INDUSTRIES, INC. (JP) 2008-05-20 US disclosed
US-7374856-B2 Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film TORAY INDUSTRIES, INC. (JP) 2008-05-20 US disclosed
EP-1708026-A1 PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART Hitachi Chemical DuPont Microsystems Ltd. (JP) 2006-10-04 EP disclosed