SCHEMBL28435488

SCHEMBL28435488

O=C1CC(Cl)=CC2=C1Oc1ccccc1O2

nearest known ligand 0.34

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
AHR P35869 3/20 0.34
NTSR1 P30989 1/20 0.32
GPR55 Q9Y2T6 1/20 0.32
MAOA P21397 1/20 0.31
MAOB P27338 1/20 0.31
CA12 O43570 1/20 0.31
CA9 Q16790 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28438089 0.83 AHR (0.45) AHR
SCHEMBL29699894 0.68 NTSR1 (0.33) NTSR1GPR55MAOB
SCHEMBL15763902 0.61 MAOA (0.46) AHRMAOAMAOBCA12CA9
SCHEMBL8932796 0.57 AHR (0.57) AHRMAOAMAOB
SCHEMBL2362430 0.57 AHR (0.57) AHRMAOAMAOB
SCHEMBL3102452 0.56 MAOA (0.56) AHRMAOAMAOB
SCHEMBL125113 0.56 MAOA (0.56) AHRMAOAMAOB
SCHEMBL8668546 0.56 MAOA (0.56) AHRMAOAMAOB
SCHEMBL29383458 0.56 MAOA (0.56) AHRMAOAMAOB
SCHEMBL29724179 0.56 MAOA (0.56) AHRMAOAMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111315841-B Curable organopolysiloxane release agent composition for thermal paper, and thermal recording label sheet 陶氏东丽株式会社 2023-02-21 CN disclosed
CN-115397891-A Polysiloxanes with radiation-crosslinkable and moisture-crosslinkable groups 瓦克化学股份公司 2022-11-25 CN disclosed
CN-114981361-A Curable organopolysiloxane composition, release coating agent formed from the composition, and laminate 陶氏东丽株式会社 2022-08-30 CN disclosed
CN-111315841-A Curable organopolysiloxane release agent composition for thermal paper, and thermal recording label sheet 陶氏东丽株式会社 2020-06-19 CN disclosed