SCHEMBL28510072

SCHEMBL28510072

CCCCOC(OCCCC)c1ccccc1C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.44
CYP2C19 P33261 4/20 0.41
CYP2C9 P11712 4/20 0.41
CYP2D6 P10635 3/20 0.41
CYP3A4 P08684 2/20 0.41
SLC22A2 O15244 1/20 0.41
SLC22A1 O15245 1/20 0.41
GRIN2D O15399 1/20 0.41
GRIN3B O60391 1/20 0.41
CHRM2 P08172 1/20 0.41
CHRM4 P08173 1/20 0.41
CHRM5 P08912 1/20 0.41
ADRA2A P08913 1/20 0.41
CHRM1 P11229 1/20 0.41
ADRA2B P18089 1/20 0.41
CHRM3 P20309 1/20 0.41
DRD1 P21728 1/20 0.41
SLC6A2 P23975 1/20 0.41
HRH2 P25021 1/20 0.41
HTR2A P28223 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27477764 0.90 ESR1 (0.48) ESR1CYP2C19CYP2C9CYP2D6CYP3A4
SCHEMBL898540 0.80 ESR1 (0.50) ESR1CYP2C19CYP2C9CYP2D6CYP3A4
SCHEMBL1539465 0.79 TDP1 (0.40) CYP2C19CYP2C9CYP2D6ADRA1ADRD3
SCHEMBL28081865 0.77 PTPN1 (0.43) LTA4HMAPK1PPARGPPARA
SCHEMBL9229753 0.76 ESR1 (0.45) ESR1CYP2C19CYP2C9CYP2D6CYP3A4
SCHEMBL10717745 0.75 LTA4H (0.47) CYP2C19CYP2C9CYP2D6CHRM2CHRM4
SCHEMBL5589798 0.74 BCHE (0.43) ESR1CYP2C19CYP2D6CYP3A4LMNA
SCHEMBL1315101 0.74 ESR1 (0.40) ESR1CYP2C19CYP2C9CYP2D6CYP3A4
SCHEMBL1803434 0.74 ALDH1A1 (0.47) LMNANPSR1CYP1A2MAPK1TSHR
SCHEMBL6059479 0.73 ESR1 (0.47) ESR1CYP2C19CYP2C9CYP2D6CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114730706-A Method for manufacturing semiconductor device, dicing die-bonding integrated film, and method for manufacturing the same 昭和电工材料株式会社 2022-07-08 CN disclosed
CN-112292431-A Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same 昭和电工材料株式会社 2021-01-29 CN disclosed