SCHEMBL898540

SCHEMBL898540

CCOC(OCC)c1ccccc1C

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.50
CYP2D6 P10635 2/20 0.41
SLC6A2 P23975 2/20 0.41
SLC6A4 P31645 2/20 0.41
SLC6A3 Q01959 2/20 0.41
ADRA2A P08913 2/20 0.41
ADRA2B P18089 2/20 0.41
SLC22A2 O15244 1/20 0.41
SLC22A1 O15245 1/20 0.41
GRIN2D O15399 1/20 0.41
GRIN3B O60391 1/20 0.41
CHRM2 P08172 1/20 0.41
CHRM4 P08173 1/20 0.41
CHRM5 P08912 1/20 0.41
CHRM1 P11229 1/20 0.41
CHRM3 P20309 1/20 0.41
DRD1 P21728 1/20 0.41
HRH2 P25021 1/20 0.41
HTR2A P28223 1/20 0.41
HTR2C P28335 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27477764 0.85 ESR1 (0.48) ESR1CYP2D6SLC6A2SLC6A4SLC6A3
SCHEMBL12124965 0.81 ESR1 (0.48) ESR1CYP2D6SLC6A2SLC6A4SLC6A3
SCHEMBL28055970 0.80 ESR1 (0.35) ESR1CYP2D6SLC6A2SLC6A4SLC6A3
SCHEMBL28510072 0.80 ESR1 (0.44) ESR1CYP2D6SLC6A2SLC6A4SLC6A3
SCHEMBL6059479 0.79 ESR1 (0.47) ESR1CYP2D6SLC6A2SLC6A4SLC6A3
SCHEMBL699772 0.78 ALDH1A1 (0.38) CYP2D6CYP2C19CYP3A4NPSR1TSHR
SCHEMBL8022572 0.77 L3MBTL1 (0.43) CYP2D6SLC6A2SLC6A4CYP2C19CYP3A4
SCHEMBL29896649 0.77 IDO1 (0.39) CYP2C19CYP3A4CYP2C9TSHRACHE
SCHEMBL7101257 0.77 L3MBTL1 (0.36) ESR1TSHRACHEL3MBTL1BCHE
SCHEMBL5397237 0.77 CA1 (0.48) ADRA2BLMNANPSR1TSHRACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118053799-A Method for manufacturing semiconductor device 株式会社力森诺科 2024-05-17 CN disclosed
CN-117940478-A Phenol resin, epoxy resin, curable resin composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article DIC株式会社 2024-04-26 CN disclosed
CN-117157733-A Method for manufacturing semiconductor device and dicing die-bonding integrated film 株式会社力森诺科 2023-12-01 CN disclosed
CN-110945634-B Heat-dissipating die bonding film and dicing die bonding film 株式会社力森诺科 2023-08-29 CN disclosed
CN-112292431-B Crystal cutting and crystal bonding integrated film and pressure-sensitive adhesive film used by same 昭和电工材料株式会社 2022-09-02 CN disclosed
CN-114641848-A Dicing die-bonding integrated film, method for manufacturing the same, and method for manufacturing semiconductor device 昭和电工材料株式会社 2022-06-17 CN disclosed
CN-113348533-B Method for evaluating pickup property, die-cut/die-bond integrated film, method for evaluating the same, method for sorting the same, and method for manufacturing semiconductor device 昭和电工材料株式会社 2022-06-03 CN disclosed
WO-2021095370-A1 DICING DIE-BONDING INTEGRATED FILM, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD 昭和電工マテリアルズ株式会社 2021-05-20 WO disclosed
WO-2021095302-A1 SEMICONDUCTOR DEVICE PRODUCTION METHOD, DICING DIE-BONDING INTEGRATED FILM, AND PRODUCTION METHOD THEREFOR 昭和電工マテリアルズ株式会社 2021-05-20 WO disclosed
WO-2021095369-A1 INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 昭和電工マテリアルズ株式会社 2021-05-20 WO disclosed
CN-1346375-A Sealing agent for liquid-crystal display, cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element MITSUI CHEMICALS INC (JP) 2002-04-24 CN disclosed
EP-1153952-A1 SEALING AGENT FOR LIQUID-CRYSTAL DISPLAY CELL, COMPOSITION FOR SEALING AGENT FOR LIQUID-CRYSTAL DISPLAY CELL, AND LIQUID-CRYSTAL DISPLAY ELEMENT Mitsui Chemicals, Inc. (JP) 2001-11-14 EP disclosed
CN-1066746-C Aromatic hydroxycarboxylic acid resin and use thereof MITSUI CHEMICALS INC (JP) 2001-06-06 CN disclosed
CN-1296024-A Partial esterification products of aromatic hydroxy-carboxylic resin and use thereof MITSUI CHEMICALS INC (JP) 2001-05-23 CN disclosed
CN-1239116-A Epoxy-resin composition and use thereof MITSUI CHEMICALS INC (US) 1999-12-22 CN disclosed
CN-1127763-A Aromatic hydroxycarboxylic acid resin and use thereof MITSUI TOATSU CHEMICALS (JP) 1996-07-31 CN disclosed
CN-1062544-A The compositions of thermosetting resin that contains arylamino resin MITSUI TOATSU CHEMICALS (JP) 1992-07-08 CN disclosed
CN-1017055-B Process for producing aromatic amine resin MITSUI TOATSU CHEMICALS (JP) 1992-06-17 CN disclosed
CN-1037721-A Compositions of thermosetting resin MITSUI TOATSU CHEMICALS (JP) 1989-12-06 CN disclosed
CN-1032806-A Aromatic amine resin, its preparation method and application in thermosetting resin composition MITSUI TOATSU CHEMICALS (JP) 1989-05-10 CN disclosed