SCHEMBL285179

SCHEMBL285179

N#CCn1nnc2ccccc21

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.70
GLA P06280 1/20 0.70
RAB9A P51151 3/20 0.61
NPC1 O15118 2/20 0.61
KDM4E B2RXH2 1/20 0.61
HPGD P15428 1/20 0.61
HSD17B10 Q99714 1/20 0.61
SLC9A1 P19634 8/20 0.59
GRM2 Q14416 2/20 0.56
MAPT P10636 1/20 0.53
TDP1 Q9NUW8 1/20 0.51
KCNMA1 Q12791 1/20 0.50
EGLN3 Q9H6Z9 1/20 0.50
MGAM O43451 1/20 0.49
AMY1A P0DUB6 1/20 0.49
GAA P10253 1/20 0.49
SI P14410 1/20 0.49
MGAM2 Q2M2H8 1/20 0.49
CYP2D6 P10635 1/20 0.47
RPS6KA3 P51812 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30360007 1.00 TSHR (0.70) TSHRGLARAB9ANPC1KDM4E
SCHEMBL9065452 0.81 RAB9A (0.61) TSHRGLARAB9ANPC1KDM4E
SCHEMBL769428 0.81 RAB9A (0.61) TSHRGLARAB9ANPC1KDM4E
SCHEMBL15078635 0.80 TSHR (0.82) TSHRGLARAB9ANPC1KDM4E
SCHEMBL1774497 0.78 SLC9A1 (0.70) TSHRGLARAB9ANPC1KDM4E
SCHEMBL31234269 0.78 SLC9A1 (0.70) TSHRGLARAB9ANPC1KDM4E
SCHEMBL19848199 0.76 POLB (0.43) TSHRGLARAB9ANPC1KDM4E
SCHEMBL12204523 0.76 RAB9A (1.00) TSHRGLARAB9ANPC1KDM4E
SCHEMBL19848267 0.76 TSHR (0.43) TSHRGLARAB9ANPC1KDM4E
SCHEMBL19848607 0.76 TSHR (0.43) TSHRGLARAB9ANPC1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 287 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119487140-A CMP slurry composition for polishing copper barrier layer YC化工股份有限公司 2025-02-18 CN claimed
WO-2024010249-A1 CMP SLURRY COMPOSITION FOR POLISHING COPPER BARRIER LAYER 와이씨켐 주식회사 2024-01-11 WO claimed
CN-113589662-B Composition, stripping liquid, application of stripping liquid in stripping of photoresist or photoresist residues and stripping method 浙江奥首材料科技有限公司 2022-07-12 CN claimed
CN-113589662-A Composition, stripping liquid, application of stripping liquid in stripping of photoresist or photoresist residues and stripping method 浙江奥首材料科技有限公司 2021-11-02 CN claimed
US-9751984-B2 Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) 2017-09-05 US claimed
US-9488912-B2 Method of forming protective film for touch panel electrode, photosensitive resin composition and photosensitive element, and method of manufacturing touch panel HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-11-08 US claimed
CN-1860198-B Non-polymeric organic particles for chemical mechanical polishing DYNEA CHEMICALS OY 2010-06-16 CN claimed
WO-2010053388-A1 NEW 4,6-DISUBSTITUTED 2-(4-METHYLPIPERAZIN-1-YL)PYRIDINE DERIVATIVES, A PROCESS FOR THEIR PREPARATION, PHARMACEUTICAL COMPOSITION CONTAINING THESE COMPOUNDS, THEIR USE, A METHOD FOR MODULATING MONOAMINERGIC RECEPTOR ACTIVITY AND A MONOAMINERGIC RECEPTOR MODULATING AGENT INSTYTUT FARMAKOLOGII POLSKIEJ AKADEMII NAUK (PL) 2010-05-14 WO claimed
JP-2009534834-A 2009-09-24 JP claimed
CN-101437919-A CMP method for copper-containing substrates CABOT MICROELECTRONICS CORP (US) 2009-05-20 CN claimed
EP-2014797-A2 Coating composition for interconnection part of electrode and plasma display panel including the same Samsung SDI Co., Ltd. (KR) 2009-01-14 EP claimed
US-20080303439-A1 Coating composition for interconnection part of electrode and plasma display panel including the same SAMSUNG SDI CO., LTD., A CORP. OF THE REPUBLIC OF KOREA (KR) 2008-12-11 US claimed
WO-2007126672-A1 CMP METHOD FOR COPPER-CONTAINING SUBSTRATES CABOT MICROELECTRONICS CORPORATION (US) 2007-11-08 WO claimed
US-20070249167-A1 CMP method for copper-containing substrates CABOT MICROELECTRONICS CORPORATION (US) 2007-10-25 US claimed
CN-1860198-A non-polymeric organic particles for chemical mechanical polishing DYNEA CHEMICALS OY (FI) 2006-11-08 CN claimed
US-20050005525-A1 Non-polymeric organic particles for chemical mechanical planarization DYNEA AUSTRIA GMBH (AT) 2005-01-13 US claimed
EP-1218739-A4 2-AMINOPYRIDINE DERIVATIVES AND COMBINATORIAL LIBRARIES THEREOF LION BIOSCIENCE AG (DE) 2003-06-04 EP claimed
US-6458789-B1 ANTICOAGULENTS, ANTIHISTAMINES, ANTISEPTICS, ANTIARRHYTHMICS AND ANTIRHEUMATICS LION BIOSCIENCE AG (DE) 2002-10-01 US claimed
EP-1218739-A1 2-AMINOPYRIDINE DERIVATIVES AND COMBINATORIAL LIBRARIES THEREOF TREGA BIOSCIENCES, INC. (US) 2002-07-03 EP claimed
WO-2001023887-A1 2-AMINOPYRIDINE DERIVATIVES AND COMBINATORIAL LIBRARIES THEREOF LION BIOSCIENCE AG (DE) 2001-04-05 WO claimed