SCHEMBL28533700

SCHEMBL28533700

O=C(O)C1=CC(=O)N(N2C(=O)CCC2=O)C1=O

nearest known ligand 0.35

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA9 Q16790 1/20 0.35
ALDH1A1 P00352 1/20 0.30
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6780333 0.75 ALDH1A1 (0.33) ALDH1A1HTT
SCHEMBL1357299 0.70 ALDH1A1 (0.35) ALDH1A1
SCHEMBL1524563 0.70 MEN1 (0.31) ALDH1A1HTT
SCHEMBL19583420 0.68 CA12 (0.32) CA12CA1CA9ALDH1A1HTT
SCHEMBL9821807 0.66 HIF1A (0.37) CA12CA9ALDH1A1
Acetic Acid SCHEMBL4526905 0.65 CA12 (0.34) CA12CA1CA9ALDH1A1HTT
SCHEMBL558683 0.65 ALDH1A1 (0.42) ALDH1A1HTT
SCHEMBL28518185 0.64 MEN1 (0.31) ALDH1A1
SCHEMBL27607300 0.63 POLB (0.42) ALDH1A1
SCHEMBL2308600 0.62 ALDH1A1 (0.39) ALDH1A1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118240139-A Alkali-soluble resin, photoresist composition and application thereof 固安鼎材科技有限公司 2024-06-25 CN claimed
CN-116135895-A Alkali-soluble resin and preparation method and application thereof 固安鼎材科技有限公司 2023-05-19 CN claimed
CN-108003290-B Alkali-soluble resin polymer, preparation method thereof, photosensitive resin composition and application thereof 固安鼎材科技有限公司 2021-03-05 CN claimed
CN-118240139-A Alkali-soluble resin, photoresist composition and application thereof 固安鼎材科技有限公司 2024-06-25 CN disclosed
CN-116135895-A Alkali-soluble resin and preparation method and application thereof 固安鼎材科技有限公司 2023-05-19 CN disclosed