Benzidine

Benzidine

SCHEMBL28540941

NC1=CC=CC(N)(O)C1.Nc1ccc(-c2ccc(N)cc2)cc1

nearest known ligand 0.39

Full drug profile on Sugi Atlas →

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 2/20 0.39
TDP1 Q9NUW8 2/20 0.39
ALDH1A1 P00352 1/20 0.39
TP53 P04637 1/20 0.39
TAAR1 Q96RJ0 1/20 0.34
HSD17B10 Q99714 1/20 0.34
KIF11 P52732 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28994957 0.68
SCHEMBL591997 0.66
SCHEMBL28703048 0.65
SCHEMBL8522405 0.65
SCHEMBL6278856 0.65
Hydrochloric Acid SCHEMBL5072257 0.64 HDAC1 (0.34)
SCHEMBL4438733 0.64 CYP3A4 (0.39) CYP3A4TDP1ALDH1A1TP53TAAR1
Benzidine SCHEMBL2466323 0.63 ALDH1A1 (0.85) CYP3A4TDP1ALDH1A1TP53TAAR1
Benzidine SCHEMBL29120747 0.63 ALDH1A1 (0.85) CYP3A4TDP1ALDH1A1TP53TAAR1
Benzidine SCHEMBL9980982 0.63 ALDH1A1 (0.85) CYP3A4TDP1ALDH1A1TP53TAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116925027-A Compound for photosensitive resin, heat-resistant resin, photosensitive resin composition, patterned film, and display device 武汉柔显科技股份有限公司 2023-10-24 CN disclosed
CN-116841121-A Photosensitive resin composition, method for producing pattern cured film, and use thereof 武汉柔显科技股份有限公司 2023-10-03 CN disclosed
CN-116774524-A Photosensitive resin composition, method for producing pattern cured product, and use thereof 武汉柔显科技股份有限公司 2023-09-19 CN disclosed
CN-112940250-B Photosensitive resin composition and photosensitive resin film 武汉柔显科技股份有限公司 2022-09-23 CN disclosed
CN-114326306-A Photosensitive resin composition, photosensitive resin composition film, and patterned cured product 武汉柔显科技股份有限公司 2022-04-12 CN disclosed
CN-112940250-A Resin, photosensitive resin composition, and photosensitive resin film 武汉柔显科技股份有限公司 2021-06-11 CN disclosed
CN-112521296-B Diamine compound, heat-resistant resin or heat-resistant resin precursor using same, photosensitive resin composition, cured film, and display device 武汉柔显科技股份有限公司 2021-05-11 CN disclosed
CN-112521296-A Diamine compound, heat-resistant resin or heat-resistant resin precursor using same, photosensitive resin composition, cured film, and display device 武汉柔显科技股份有限公司 2021-03-19 CN disclosed