Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | PTGS1 | P23219 | 4/20 | 0.36 |
| ▸ | PTGS2 | P35354 | 3/20 | 0.36 |
| ▸ | RNASEH1 | O60930 | 1/20 | 0.35 |
| ▸ | TRPA1 | O75762 | 3/20 | 0.34 |
| ▸ | TP53 | P04637 | 2/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 3/20 | 0.34 |
| ▸ | HTT | P42858 | 1/20 | 0.34 |
| ▸ | CACNA1C | Q13936 | 1/20 | 0.34 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.34 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.34 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.34 |
| ▸ | HTR2B | P41595 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | ALOX5 | P09917 | 2/20 | 0.32 |
| ▸ | GAA | P10253 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | G6PD | P11413 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2860977 | 0.83 | TRPA1 (0.47) | CA1CA2PTGS1PTGS2TRPA1 | |
| SCHEMBL29375037 | 0.79 | TYR (0.47) | CA1CA2TRPA1LMNACHRM1 | |
| SCHEMBL757574 | 0.79 | TYR (0.47) | CA1CA2TRPA1LMNACHRM1 | |
| SCHEMBL16812656 | 0.79 | TP53 (0.47) | CA1CA2PTGS1PTGS2TRPA1 | |
| SCHEMBL16812648 | 0.79 | LMNA (0.55) | CA1CA2PTGS1PTGS2TRPA1 | |
| SCHEMBL20808745 | 0.78 | PTGS1 (0.41) | CA1CA2PTGS1PTGS2TRPA1 | |
| SCHEMBL24146088 | 0.78 | HDAC1 (0.38) | CA1CA2PTGS2RNASEH1TDP1 | |
| SCHEMBL8151507 | 0.78 | PTGS1 (0.44) | CA1CA2PTGS1PTGS2TDP1 | |
| SCHEMBL20808746 | 0.77 | CA1 (0.46) | CA1CA2PTGS1PTGS2LMNA | |
| SCHEMBL20808757 | 0.77 | LMNA (0.47) | CA1CA2PTGS1PTGS2LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 196 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-1623274-A2 | PHOTORESIST COMPOSITIONS | AZ Electronic Materials USA Corp. (US) | 2006-02-08 | — | — | EP | claimed |
| US-6905809-B2 | Photoresist compositions | CLARIANT FINANCE (BVI) LIMITED (VG) | 2005-06-14 | — | — | US | claimed |
| WO-2004088423-A2 | PHOTORESIST COMPOSITIONS | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2004-10-14 | — | — | WO | claimed |
| US-20040197696-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-20040197704-A1 | Photoresist compositions | AZ ELECTRONIC MATERIALS USA CORP. | 2004-10-07 | — | — | US | claimed |
| US-6790582-B1 | NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT | CLARIANT FINANCE BVI LIMITED (VG) | 2004-09-14 | — | — | US | claimed |
| WO-2024150700-A1 | RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143211-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143210-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024101266-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-16 | — | — | WO | disclosed |
| EP-0385442-B1 | Positive-working photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 1994-06-01 | — | — | EP | disclosed |
| EP-0540032-A1 | Photoresist composition and etching method | FUJI PHOTO FILM CO., LTD. (JP) | 1993-05-05 | — | — | EP | disclosed |
| US-5153096-A | Heat resistance, resolution, accuracy, for semiconductors | FUJI PHOTO FILM CO., LTD. (JP) | 1992-10-06 | — | — | US | disclosed |
| US-5143816-A | Lithography printing plates; good adhesion | FUJI PHOTO FILM CO., LTD. (JP) | 1992-09-01 | — | — | US | disclosed |
| US-5130224-A | Naphthoquinonediazide and a light absorbers | FUJI PHOTO FILM CO., LTD. (JP) | 1992-07-14 | — | — | US | disclosed |
| EP-0445680-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |
| EP-0445819-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |