SCHEMBL757574

SCHEMBL757574

Cc1cc(C(c2cc(C)c(O)c(C)c2)c2ccc(O)cc2O)cc(C)c1O

nearest known ligand 0.49

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TYR P14679 1/20 0.47
TRPA1 O75762 1/20 0.37
LMNA P02545 1/20 0.37
CHRM1 P11229 1/20 0.37
SLC6A2 P23975 1/20 0.37
ADRA1A P35348 1/20 0.37
HTR2B P41595 1/20 0.37
CA1 P00915 1/20 0.37
CA2 P00918 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29375037 1.00 TYR (0.47) TYRTRPA1LMNACHRM1SLC6A2
SCHEMBL16812648 0.85 LMNA (0.55) TRPA1LMNACHRM1SLC6A2ADRA1A
SCHEMBL30899203 0.83 ACHE (0.38) TYRTRPA1CA1CA2
SCHEMBL17445332 0.83 ESR2 (0.41) TYRCHRM1ADRA1AHTR2BCA1
SCHEMBL23082245 0.80 TYR (0.46) TYRTRPA1
SCHEMBL29372953 0.79 GABRA1 (0.47) TRPA1LMNASLC6A2HTR2BCA1
SCHEMBL36014 0.79 GABRA1 (0.47) TRPA1LMNASLC6A2HTR2BCA1
SCHEMBL2856400 0.79 CA1 (0.38) TRPA1LMNACHRM1SLC6A2ADRA1A
SCHEMBL3793824 0.78 TYR (0.50) TYR
SCHEMBL6328472 0.77 TYR (0.44) TYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 107 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2980058-B1 COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND TOKYO OHKA KOGYO CO LTD (JP) 2023-05-03 EP disclosed
CN-109062007-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-111217946-B Composition comprising a compound containing a vinyl group 东京应化工业株式会社 2022-12-06 CN disclosed
CN-108693710-B Positive photosensitive polysiloxane composition 奇美实业股份有限公司 2022-12-02 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
CN-107870516-B Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2022-08-02 CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 CN disclosed
US-11142629-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-12 US disclosed
CN-106154750-B Photosensitive polysiloxane composition, protective film and element with protective film 奇美实业股份有限公司 2021-09-14 CN disclosed
CN-106019841-B Photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device 东京应化工业株式会社 2021-03-26 CN disclosed
US-5738968-A Positive photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-04-14 US disclosed
US-5728504-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-03-17 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
EP-0477691-B1 Positive-type photoresist composition FUJI PHOTO FILM CO LTD (JP) 1997-07-16 EP disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed
US-5340686-A Alkali soluble phenol novolak resin, 1,2-quinone diazide compound and low molecular weight novolak compound FUJI PHOTO FILM CO., LTD. (JP) 1994-08-23 US disclosed
EP-0477691-A2 Positive-type photoresist composition FUJI PHOTO FILM CO., LTD. (JP) 1992-04-01 EP disclosed