Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL137721 | 0.75 | CTSD (0.32) | — | |
| Hydrochloric Acid SCHEMBL9079100 | 0.73 | CTSD (0.31) | — | |
| Hydrochloric Acid SCHEMBL4443526 | 0.71 | CA4 (0.30) | — | |
| Bromide SCHEMBL7870145 | 0.70 | CTSD (0.32) | — | |
| Fluoride Ion SCHEMBL5613214 | 0.70 | CTSD (0.32) | — | |
| SCHEMBL4576329 | 0.70 | CTSD (0.32) | — | |
| Potassium Ion SCHEMBL8652402 | 0.69 | CTSD (0.31) | — | |
| Hydrochloric Acid SCHEMBL9079594 | 0.68 | — | — | |
| Hydrochloric Acid SCHEMBL7178433 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL6304997 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113168093-B | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-113383273-B | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-113383273-A | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2021-09-10 | — | — | CN | disclosed |
| CN-113168093-A | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2021-07-23 | — | — | CN | disclosed |