Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PRKCA | P17252 | 9/20 | 0.70 |
| ▸ | PRKCE | Q02156 | 2/20 | 0.49 |
| ▸ | PRKCQ | Q04759 | 2/20 | 0.49 |
| ▸ | PRKCD | Q05655 | 2/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL97727 | 0.91 | PRKCA (0.56) | PRKCAPRKCEPRKCQPRKCD | |
| SCHEMBL4977858 | 0.86 | PRKCA (0.51) | PRKCAPRKCEPRKCQPRKCD | |
| SCHEMBL14415223 | 0.85 | PRKCA (0.74) | PRKCAPRKCEPRKCQPRKCD | |
| SCHEMBL8843318 | 0.84 | PRKCA (0.72) | PRKCAPRKCEPRKCQPRKCD | |
| SCHEMBL98666 | 0.79 | PRKCA (0.43) | PRKCA | |
| SCHEMBL30673065 | 0.79 | PRKCA (0.43) | PRKCA | |
| SCHEMBL2859972 | 0.75 | PRKCA (0.40) | PRKCA | |
| SCHEMBL14415219 | 0.75 | PRKCA (0.59) | PRKCAPRKCEPRKCQPRKCD | |
| SCHEMBL14837300 | 0.75 | MAPT (0.48) | PRKCA | |
| SCHEMBL11896012 | 0.74 | PRKCA (0.63) | PRKCAPRKCEPRKCQPRKCD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |